Analysis and performance of BGA interconnects for RF packaging

Staiculescu, D.; Pham, Anh-Vu; Laskar, J.; Consolazio, S.; Moghe, S.

doi:10.1109/rfic.1998.682064

Cited by 9 publications

(3 citation statements)

References 3 publications

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“…The distributed parameter characteristics of microwave circuit transmission structures are heavily dependent on the properties of materials (both dielectric and conductive) and manufacturing capabilities. Careful design is required for the transmission structures within the substrate [13] and the interconnection interfaces with the motherboard [14,27]. To validate the feasibility of utilizing LTCC-BGA packaging with Ag-based material for ENEPIG surface modification as a conductive medium, a three-dimensional electromagnetic field analysis is conducted to design and simulate the internal vertical interconnection structure within LTCC and BGA transmission interfaces.…”

Section: Introductionmentioning

confidence: 99%

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

Wang,

Hou,

Huo

et al. 2023

Materials

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A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10−9 Pa·m3/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10–40 GHz frequency range while ensuring effective isolation between ports.

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Section: Introductionmentioning

confidence: 99%

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

Wang,

Hou,

Huo

et al. 2023

Materials

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“…Staiculescu et al [5] used a combination of electromagnetic (EM) analysis and fitting-to-measurements to circuit model a thru-line test case on a single-layer BGA. However, a procedure has not been developed for microwave modeling of multilayer structures.…”

Section: Introductionmentioning

confidence: 99%

Modeling of interconnections and isolation within a multilayered ball grid array package

Ito

Jackson

Hongsmatip

1999

IEEE Trans. Microwave Theory Techn.

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A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-element circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies.Index Terms-BGA, electrical isolation, microwave packaging, multichip module, package isolation, package model.

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“…They have demonstrated capabilities such as high interconnection density, high lead count, and surface mountablity. At microwave frequencies, the BGA packages have found increasing applications below 20GHz [1] [2] [3]. With the emerging wireless communication systems operating at millimeter wave frequencies, such as the local multi-point distribution services (LMDS), there is an urgent need for low cost millimeter wave IC packaging and printed circuit board (PCB) assembly technologies.…”

Section: Introductionmentioning

confidence: 99%

Development of a 36 GHz millimeter-wave BGA package

Liang

Laskar²,

Hyslop³

et al.

2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)

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We present a 36GHz ball grid array (BGA) package design and its experimental characterization. A novel wide band de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertionloss better than 0.3dB to 36GHz. The performance is demonstrated by measuring a MMIC amplifier built on the package. Our results show that the BGA is a cost-effective solution for millimeter wave RFIC packaging.

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Analysis and performance of BGA interconnects for RF packaging

Cited by 9 publications

References 3 publications

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

Modeling of interconnections and isolation within a multilayered ball grid array package

Development of a 36 GHz millimeter-wave BGA package

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