2015
DOI: 10.1007/s11432-015-5398-3
|View full text |Cite
|
Sign up to set email alerts
|

Area-efficient transient power-rail electrostatic discharge clamp circuit with mis-triggering immunity in a 65-nm CMOS process

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
5
0

Year Published

2016
2016
2023
2023

Publication Types

Select...
3

Relationship

1
2

Authors

Journals

citations
Cited by 3 publications
(5 citation statements)
references
References 6 publications
0
5
0
Order By: Relevance
“…R on of each investigated circuit is relatively large in Figure 6 compared with other pure componentlevel orientated designs [2][3][4][5][6][7][8][9][10][11][12][13][14][15], confirming the validity of the utilized SB layout strategy for on-chip ESD elements burdening less system ESD current in PCB applications. Table 3 summarizes TLP test results in this sub-section.…”
Section: Tlp Test Resultsmentioning
confidence: 64%
See 4 more Smart Citations
“…R on of each investigated circuit is relatively large in Figure 6 compared with other pure componentlevel orientated designs [2][3][4][5][6][7][8][9][10][11][12][13][14][15], confirming the validity of the utilized SB layout strategy for on-chip ESD elements burdening less system ESD current in PCB applications. Table 3 summarizes TLP test results in this sub-section.…”
Section: Tlp Test Resultsmentioning
confidence: 64%
“…A three-terminal test method presented in [12] is employed in this work to characterize turn-on behavior of the proposed circuit with respect to different transient pulses. In the three-terminal test method, the The concerned rise-times of applied pulses on V DD of TC include 5 ns and 100 µs in correspondence with the simulation stimuli in Figure 4.…”
Section: Turn-on Verification Test Resultsmentioning
confidence: 99%
See 3 more Smart Citations