“…It took until 2005 before the company Infinera introduced the first truly complex PIC in a commercial wavelength division multiplexing (WDM) system: a 10-channel WDM transmitter with more than 50 components integrated on a single InP chip, with a total capacity of 100 Gb/s [8]. Until now this is the only PIC of such a complexity that has been introduced commercially, although recent developments in the field of advanced modulation formats for telecommunications systems (like diquadrature phase-shift keying (DQPSK), pulse modulation DQPSK and quadrature amplitude modulation) indicate that other highly complex PICs will follow soon [9][10][11][12].…”
Similarities and differences between photonic and microelectronic integration technology are discussed and a vision of the development of InP-based photonic integration in the coming decade is given
“…It took until 2005 before the company Infinera introduced the first truly complex PIC in a commercial wavelength division multiplexing (WDM) system: a 10-channel WDM transmitter with more than 50 components integrated on a single InP chip, with a total capacity of 100 Gb/s [8]. Until now this is the only PIC of such a complexity that has been introduced commercially, although recent developments in the field of advanced modulation formats for telecommunications systems (like diquadrature phase-shift keying (DQPSK), pulse modulation DQPSK and quadrature amplitude modulation) indicate that other highly complex PICs will follow soon [9][10][11][12].…”
Similarities and differences between photonic and microelectronic integration technology are discussed and a vision of the development of InP-based photonic integration in the coming decade is given
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