“…The morphologies of the resulting silicon surfaces can be controlled by varying the process parameters, such as the size, shape and surface coverage of noble metal nanoparticles, etchant concentration and the etching time. 103 This etching technique can be applied to c-Si, mc-Si, and amorphous Si (a-Si), 104,105 as well as other materials, such as GaAs, GaN, and SiC. 92 It has grown increasingly popular over the last decade, especially in a research context, and remains as a mainstream etching method.…”