C4NP Technology for Lead Free Solder Bumping

Laine, E.; Perfecto, Eric; Campbell, B.; Wood, JodiAnne T.; Busby, Jeremy T.; Garant, J.; Guerin, L.

doi:10.1109/ectc.2007.373966

Cited by 9 publications

(3 citation statements)

References 2 publications

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“…To address these major issues associated with Pb-free solder, C4NP technology has been developed [6], along with IBM's commercialization partner, SUSS MicroTec. [7] The newly developed manufacturing tools for 300mm wafers have backward 200mm compatibility. Thus, the high volume manufacturing (HVM) toolset that has been delivered to IBM routinely bumps 300mm wafers, but can seamlessly process 200mm whenever the need arises.…”

Section: Introductionmentioning

confidence: 99%

C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications

Shih

Dang

Gruber

et al. 2008

2008 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Controlled Collapse Chip Connection -New Process (C4NP) technology is a novel solder bumping technology developed by IBM to address the limitations of existing bumping technologies. Through continuous improvements in processes, materials and defect control, C4NP technology has been successfully implemented at IBM in the manufacturing of all 300mm Pb-free solder bumped wafers. Both 200 µm and 150 µm pitch products have been qualified and are currently ramping up volume production.Extendibility of C4NP to 50 µm ultra-fine pitch microbump application has been successfully demonstrated with the existing C4NP manufacturing tools. Targeted applications for microbumps are three-dimensional (3D) chip integration and the conversion of memory wafers from wirebonding (WB) to C4 bumping. The metrology data on solder volume, bump height, defect and yield have been characterized by RVSI inspection. This paper reviews the C4NP processes from mold manufacturing, solder fill and solder transfer onto 300 mm wafers, along with defect and yield analysis. Reliability challenges as well as solutions in the development and qualification of flip chip Pb-free solder joint are also reviewed. In addition to a suitable under bump metallurgy (UBM), a robust lead-free solder alloy with precisely controlled composition and special alloy doping is needed to enhance performance and reliability.

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Section: Introductionmentioning

confidence: 99%

C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications

Shih

Dang

Gruber

et al. 2008

2008 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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“…However, not all of the C4 bumping technologies are extendable to fine-pitch applications for volume production at low cost. Recently, C4 -New Process (C4NP) technology has been developed and adopted by IBM in manufacturing production of 300 mm Pbfree solder bumped wafers [5]. Compared to the other bumping technologies, C4NP has demonstrated several advantages that include solder choice flexibility (easy change to desired solder materials and compositions), high-volume manufacturability, environmentally friendly operation, ( "dry" process, no plating chemicals involved or waste to be disposed), and low cost.…”

Section: Introductionmentioning

confidence: 99%

50μm pitch Pb-free micro-bumps by C4NP technology

Dang

Shih

Buchwalter

et al. 2008

2008 58th Electronic Components and Technology Conference

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Controlled collapse chip connection new process (C4NP) is currently used in IBM manufacturing for all 300 mm Pbfree wafer bumping for flip chip packages. In this study, the extendibility of C4NP technology to ultra fine pitch applications has been explored. Reusable C4NP glass molds were fabricated and characterized for 50µm pitch application. Mold fill and wafer transfer with Pb-free solders have been demonstrated using both 200mm and 300mm wafers in a manufacturing environment. Significant improvement in bump yield was achieved for these early demonstations of fine pitch interconnections through process optimization and contamination control. Challenge in wafer inspection metrology is discussed for the 50µm pitch micro-bumps. Mechanical strength of the C4NP micro-bumps has been characterized using test dies with a full area array of microbumps.

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“…Recently, IBM announced the successful qualifi cation and implementation of lead-free, fl ipchip bumping for all 300 mm wafers in high-volume manufacturing production using C4NP technology with an equipment partnership with Suss. 7,8 This paper, will review the conventional wafer-bumping technologies currently in practice and also the emerging technology of C4NP with its inherent advantages and challenges as compared to other technologies.…”

Section: Introductionmentioning

confidence: 99%