providing a second system for non-mechanical liquid metal manipulation. Zhang et al. fed aluminum chips to a galinstan droplet as fuel for self-propulsion, [19] and have since developed non-contacting magnetic controls for the droplet. [20] Finally, a large category of recent research has used electricity to create relative motion and shape change in liquid metals, [21][22][23] enabling non-contacting pumps for microfluidic flow [24] and cooling, [25] self-destructive circuitry (path-destructive liquid metal droplet motion), [26] and most recently as a source for rigid-body locomotion. [27] It is well known that gallium oxidizes rapidly in normal atmospheric conditions, or in any environment with oxygen levels above 1 ppm, [11,28,29] forming a gallium oxide that has been studied in detail. [30][31][32] This oxide is solid at room temperature and forms a nanoscale stabilizing shell around liquid gallium indium alloys, enabling the liquid metal to be patterned onto, and subsequently adhere to, many different material surfaces (via a plethora of techniques). [33] If the oxide is removed, the liquid metal loses its adhesion to the substrate and will reflow under the influence of gravity (or other forces), enabling a fixed liquid metal pattern to change. In other words, oxide removal enables real-time, non-mechanical manipulation of liquid metals. This has typically been done either in nitrogen boxes (via passive oxide prevention) or in chemical etchant baths (via active oxide removal). [18,19,21,[24][25][26] Unfortunately, these methods require enclosed (air-tight or water-proof) chambers that limit the practical applications for manipulation of liquid metal circuits on the fly, as the circuits must remain inside the chamber.The two main etchants used for aqueous oxide removal are hydrochloric acid (HCl, a low-pH acid) [15,18,21,30,31,34] and sodium hydroxide (NaOH, a high-pH base). [19,21,22,[24][25][26] Both of these etchants mix readily with water and can be contained safely at high concentrations. A non-aqueous alternative for oxide removal comes through exposing the liquid metals to concentrated HCl vapor, [35][36][37][38][39] but practical applications of this are generally limited to environments that can withstand the presence of a highly corrosive gas.In this work, we demonstrate control over the surface oxide of liquid metal droplets, which in turn controls the wetting and adhesion of those drops on a substrate, using purely environmental stimuli. We compare the use of highly acidic HCl and highly alkaline NaOH (in solution) in removing the oxide to release pinned droplets. We show that although both solvent solutions result in high contact angles between the droplet and the substrate, NaOH achieves this result at a rate that is orders of magnitude faster than HCl. We further explore the use of neutral distilled water to regrow the oxide and manipulate the contact area of the liquid metal droplet on the surface, causing the droplet to readhere to the substrate. Finally, we apply this environmentally control...