1970
DOI: 10.1149/1.2407352
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Characterization of Semiconductor Materials

Abstract: not Available.

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Cited by 29 publications
(18 citation statements)
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“…All 3C pits were tetrahedral depressions into the surface with equilateral triangle sides aligned to the /11 0 0S 4H-SiC substrate direction. This is the typical shape of TEDs in the (111) surface of cubic semiconductor crystals [16]. Similar 3C pits have also been observed by Neudeck et al [17] after growth of 3C-SiC films on 4H/6H-SiC mesas and subsequent KOH etching of the as-grown films.…”
Section: Larger and Smaller Tdssupporting
confidence: 84%
“…All 3C pits were tetrahedral depressions into the surface with equilateral triangle sides aligned to the /11 0 0S 4H-SiC substrate direction. This is the typical shape of TEDs in the (111) surface of cubic semiconductor crystals [16]. Similar 3C pits have also been observed by Neudeck et al [17] after growth of 3C-SiC films on 4H/6H-SiC mesas and subsequent KOH etching of the as-grown films.…”
Section: Larger and Smaller Tdssupporting
confidence: 84%
“…This shape is typical of dislocation etch pits commonly observed at threading edge dislocations in the (111) surface of cubic semiconductor crystals. [28] Isolated etch pits completely contained in 4H-SiC regions (of mixed polytype samples) were hexagonal with pointed bottom, as illustrated in Figure 6b. Hexagonal etch pits always appeared at the peaks of hexagonal-faceted growth hillocks associated with axial screw dislocations.…”
Section: Extended Defect Structurementioning
confidence: 91%
“…Using Vegard's law [42], the lattice constant of InGaP ternary alloys is expressed as (11) aepi(x) = XaG~p + (1 --x)ai~p. Using Vegard's law [42], the lattice constant of InGaP ternary alloys is expressed as (11) aepi(x) = XaG~p + (1 --x)ai~p.…”
Section: -Determination Of Internal Bulk Strain In the Ingap Ternary mentioning
confidence: 99%