Chemical Deposition of Ni/Pt Bi-Layer on Polyimide Film as Flexible Counterelectrodes for Dye-Sensitized Solar Cells

Cherng, Sheng‐Jye; Chen, Chih‐Ming; Dow, Wei‐Ping; Lin, Ching‐Hsuan; Chen, Sinn-wen

doi:10.1149/1.3577681

Cited by 11 publications

(19 citation statements)

References 18 publications

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“…188 In addition to PET and PEN, polyimide (PI) can also be used as a polymer substrate owing to its excellent thermal/chemical stability and superior mechanical strength. 189,190 Lin et al deposited a bilayer Ni 3 S 2 /Ni-P film on a PI substrate through a series of chemical/electrochemical processes. 191 The bottom layer Ni-P replaced conventional TCO as a conductive layer, and the top layer Ni 3 S 2 was used as the catalyst for I 3 À reduction.…”

Section: Conductive Substratesmentioning

confidence: 99%

Counter electrodes in dye-sensitized solar cells

et al. 2017

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Dye-sensitized solar cells (DSSCs) are regarded as prospective solar cells for the next generation of photovoltaic technologies and have become research hotspots in the PV field. The counter electrode, as a crucial component of DSSCs, collects electrons from the external circuit and catalyzes the redox reduction in the electrolyte, which has a significant influence on the photovoltaic performance, long-term stability and cost of the devices. Solar cells, dye-sensitized solar cells, as well as the structure, principle, preparation and characterization of counter electrodes are mentioned in the introduction section. The next six sections discuss the counter electrodes based on transparency and flexibility, metals and alloys, carbon materials, conductive polymers, transition metal compounds, and hybrids, respectively. The special features and performance, advantages and disadvantages, preparation, characterization, mechanisms, important events and development histories of various counter electrodes are presented. In the eighth section, the development of counter electrodes is summarized with an outlook. This article panoramically reviews the counter electrodes in DSSCs, which is of great significance for enhancing the development levels of DSSCs and other photoelectrochemical devices.

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Section: Conductive Substratesmentioning

confidence: 99%

Counter electrodes in dye-sensitized solar cells

et al. 2017

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“…The agglomerated Ni nanoparticles were distributed non-uniformly on the PI surface as shown in Figure 8c. It has been reported that the Ni nanoparticle film formed on PI was highly resistive due to a high sheet resistance (109 MΩ/γ) [31]. The Ni nanoparticles within the PAA layer also distributed non-uniformly and their particle sizes were 7.5-19 nm as shown in Figure 8d.…”

Section: Cross-sectional Characterization Of Metallized Pi Filmmentioning

confidence: 88%

“…In contrast, solution-based electrochemical deposition is a cost-effective method. Prior to electrochemical deposition, the inert PI surface needs to be activated/modified by a base treatment of potassium hydroxide (KOH), ion exchange, and catalyst reduction [4,8,10,[27][28][29][30][31][32][33][34]. Pd is a traditional catalyst due to its superior catalytic activity, but is expensive.…”

Section: Metallization Process Of Pimentioning

confidence: 99%

“…Pd is a traditional catalyst due to its superior catalytic activity, but is expensive. Therefore, nano-sized Ni is proposed as an alternative catalyst [30,31]. After forming a catalytic nanoparticle layer on the PI surface, a thin metallic layer-usually a nickel (Ni) diffusion barrier-is grown by electroless deposition [2,18,24,30,31,35].…”

Section: Metallization Process Of Pimentioning

confidence: 99%

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Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Lin

Chen

2017

Metals

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Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI.

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“…The ELD of Ni/P layers is a catalytic reaction that requires either a trace amount of seed Ni [5,6] or noble metals such as palladium [7,8] to lower the activation energy for nucleation and growth. Because the ELD process occurs on the catalyst-attached Si surface, the adhesion of Ni/P films is related to the interfacial properties of the catalyst and Si surface.…”

Section: Introductionmentioning

confidence: 99%