“…For example, Fig. 13 is a plot of the heavy-ion SEU cross section for Sandia 1-Mbit SRAMs irradiated from the front side with the substrate in place (standard SEU characterization) and irradiated from the backside with the substrate removed [7]. The SRAMs were irradiated at the Texas A&M University heavy-ion cyclotron (TAMU).…”
Section: Applicationsmentioning
confidence: 99%
“…Fig. 14 is a comparison of TPA SEU measurements on Sandia 1-Mbit SRAMs with and without the back substrate removed [7]. Plotted are the heavy-ion threshold LETs ( ) versus the square of the laser pulse threshold energy for six of the 64-kbit blocks with different feedback resistors that make up the 1-Mbit Sandia SRAM.…”
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
“…For example, Fig. 13 is a plot of the heavy-ion SEU cross section for Sandia 1-Mbit SRAMs irradiated from the front side with the substrate in place (standard SEU characterization) and irradiated from the backside with the substrate removed [7]. The SRAMs were irradiated at the Texas A&M University heavy-ion cyclotron (TAMU).…”
Section: Applicationsmentioning
confidence: 99%
“…Fig. 14 is a comparison of TPA SEU measurements on Sandia 1-Mbit SRAMs with and without the back substrate removed [7]. Plotted are the heavy-ion threshold LETs ( ) versus the square of the laser pulse threshold energy for six of the 64-kbit blocks with different feedback resistors that make up the 1-Mbit Sandia SRAM.…”
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
“…For example, Figure 13 is a plot of the heavy-ion SEU cross section for Sandia 1-Mbit SRAMs irradiated from the front side with the substrate in place (standard SEU characterization) and irradiated from the backside with the substrate removed [7]. The SRAMs were irradiated at the Texas A&M University heavy-ion cyclotron (TAMU).…”
Section: Applicationsmentioning
confidence: 99%
“…By removing the back substrate, both SPA and TPA laser measurements can be made from the backside. Figure 14 is a comparison of TPA SEU measurements on Sandia 1-Mbit SRAMs with and without the back substrate removed [7]. Plotted are the heavy-ion threshold LETs versus the square of the laser pulse energy threshold for six of the 64-kbit blocks with different feedback resistors that make up the 1-Mbit Sandia SRAM.…”
Section: Applicationsmentioning
confidence: 99%
“…Work is in progress to understand the mechanisms for charge collection with and without the back substrate [7].…”
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavyion, and laser testing are illustrated.
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