Configuring AVM as a MES component

Cheng, Fan‐Tien; Chang, Jian; Kao, Chi-An; Chen, Ying-Lin; Peng, Ju-Lei

doi:10.1109/asmc.2010.5551454

Cited by 6 publications

(3 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Materialized view concepts also have been used for efficient data retrieval. Materialized views have been found to be very effective in speeding up query as well as update processing [19]. A few server have been schedule to run the automated jobs to generate the summarize data.…”

Section: Developing a Wip Profile Managementmentioning

confidence: 99%

Dynamic WIP Management with the BullWIP Situation for Semiconductor Fabrication Foundry

Darudi¹,

Lan²,

Ashaari³

2018

ujm

View full text Add to dashboard Cite

Complementary Metal Oxide Semiconductor(CMOS) is a complex and very delicate process in semiconductor. In typical 30,000 wafer capacity of single foundry business model, the CMOS product loads are mixed from various technologies to serve wider market segments. Total devices can be ranged from 100 to 200. This approach creates variables for process time, equipment usage, number of processing steps which leads to inconsistent WIP profiling at respective time period. Approach to maximize the output is used by changing the methodology of WIP movement through a good WIP Profile chart management. A dynamic WIP management approached can improve the FAB out ~ 5%. It will also help the factory to make a right decision to manage the WIP balancing especially when we face BullWIP situation. The Production Control will get a good benefit from this study. A linear plan is no longer work in managing BullWIP situation and an approach on how to improve the line balancing is required.

show abstract

Section: Developing a Wip Profile Managementmentioning

confidence: 99%

Dynamic WIP Management with the BullWIP Situation for Semiconductor Fabrication Foundry

Darudi¹,

Lan²,

Ashaari³

2018

ujm

View full text Add to dashboard Cite

show abstract

“…Currently, there are three main approaches to producing highquality top-layered thin films: layer transfer technology, [5][6][7][8] selective epitaxial growth, [9][10][11][12][13] and film crystallization technology. [14][15][16][17][18][19] However, it is crucial to acknowledge that the involved complex procedure lacks cost-effectiveness due to its intricate nature and high processing costs.…”

Section: Introductionmentioning

confidence: 99%

Advancements in single-crystal silicon with elevated-laser-liquid-phase-epitaxy (ELLPE) for monolithic 3D ICs

Shih,

Pan,

Chung

et al. 2024

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

In this study, we present a low thermal budget Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) technique designed for the precise fabrication of single-crystal islands (SCIs) intended for use in middle-end-of-line (MEOL) FinFETs. Each of these single-crystal islands features a (100) orientation tended from Si seeding structure and is successfully integrated as channel materials in the MEOL circuit of a monolithic 3D integrated circuit (3DIC). This technique effectively mitigates the typical performance disparities associated with poly-Si channel materials in upper tiers, addressing a significant challenge in advanced electronic device fabrication and potentially enhancing the performance and reliability of MEOL FinFETs in monolithic 3DIC.

show abstract

“…al. [11][12][13], Huang et al [14,15], and Su et al [16][17][18] provide a thorough description of solutions for an automated VM framework including various stages of automation levels, framework components and their integration into the fab environment, embedded devices for the distributed information collection and transfer and the integration of the automated VM framework into manufacturing execution systems (MES). Pan proposes a centralized fab-wide architecture utilizing the MES and FDC system and including real time SPC for VM supervision [19].…”

Section: Introductionmentioning

confidence: 99%

Framework for integration of virtual metrology and predictive maintenance

Roeder

Mattes

Pfeffer

et al. 2012

2012 SEMI Advanced Semiconductor Manufacturing Conference

View full text Add to dashboard Cite

Within the ENIAC project "IMPROVE", new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers in Europe, solution providers, and research institutions. A major objective of the project is to make these new APC methods applicable in the existing fab systems of the IC manufacturers which widely differ in the automation infrastructure. A novel framework architecture for integration of the new control paradigms was researched and a software for implementation of the framework was developed. This paper describes the technical details and results of the framework development, implementation, and test

show abstract

Configuring AVM as a MES component

Cited by 6 publications

References 18 publications

Dynamic WIP Management with the BullWIP Situation for Semiconductor Fabrication Foundry

Dynamic WIP Management with the BullWIP Situation for Semiconductor Fabrication Foundry

Advancements in single-crystal silicon with elevated-laser-liquid-phase-epitaxy (ELLPE) for monolithic 3D ICs

Framework for integration of virtual metrology and predictive maintenance

Contact Info

Product

Resources

About