Contact angle and reactive wetting in the SnPb/Cu system

Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

“…The wettability enhancement by Pd adding, therefore, can be attributed to the decreasing activation energy and surface tension. Similar results were also reported on the case of Pb in Sn-Pb alloys and Ga added Sn-Zn solders [13][14][15]. Besides, needle type IMCs formed accompanied by larger capillary force, which provides another factor to improve the wetting behavior.…”

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

“…The wetting of molten solders on a solid substrate was commonly studied by making a non-reactive assumption that the interface reaction has no effect on the wetting process. However, it has been recognised that the formation of interfacial Cu 6 Sn 5 significantly improves the wettability of SnPb alloys [12,16]. A reactive model based on the investigations of wetting molten metals on ceramic or metal substrates was proposed as the intermetallic layers grow somewhere in front of the edge of the liquid droplets [182,183].…”

“…Therefore, the molten solders wet the intermetallic layer. Experimental work has clearly demonstrated the effects of interfacial formation of Cu 6 Sn 5 on the wetting kinetics of molten solders [16], however highly accurate data is needed to describe the atomic transportation process during reactive wetting, especially at the very early stage.…”

“…During past decades, the properties of Cu 6 Sn 5 have been extensively investigated [9][10][11][12][13][14][15][16] and significant progress has been made with the help of advanced characterization techniques. However, these results had never been well summarized in the literature.…”

3D Printing of Continuous Fiber Reinforced Low Melting Point Alloy Matrix Composites: Mechanical Properties and Microstructures

“…The low melting point alloys have the advantages of low melting temperatures and low surface tensions, especially the Pb50Sn50 alloy, the surface tension of which is 455 mN/m [20]. Because of the favorable wetting performance on Cu at low temperatures [21], Pb50Sn50 alloy is a suitable material for 3D printing process.…”