“…Three main groups of the approaches have been identified: 1) depth profiling by sputtering (e.g., secondary ion mass spectrometry [SIMS], secondary neutral mass spectrometry [SNMS], X‐ray photoelectron spectrometry [XPS], Auger electron spectrometry [AES], glow‐discharge optical emission spectrometry [GD‐OES], glow discharge mass spectrometry [GD‐MS], Raman depth profiling), 2) nondestructive techniques (e.g., spectroscopic ellipsometry [SE], Rutherford backscattering spectrometry [RBS], elastic recoil detection analysis [ERDA], X‐ray diffraction [XRD], angle‐dependent X‐ray emission spectroscopy [AXES]), and 3) cross‐section micro(nano)mapping (e.g., scanning transmission electron microscopy [TEM], its combination with energy‐dispersive X‐ray analysis [EDX], scanning Auger electron microscopy, Raman mapping, time‐of‐flight SIMS [TOF‐SIMS]). The tools that are capable of the determination of coating thickness are reviewed by Jones et al [ 2 ] sorting the methods in traditional (coulometry, beta‐particle backscattering, eddy current, magnetic induction, X‐ray fluorescence [XRF], X‐ray reflectometry [XRR], ultrasonic detection), offline (XPS, scanning electron microscopy [SEM], atomic force microscopy [AFM], GD‐OES) and in‐line (thermoelectric method, terahertz time‐domain spectroscopy [THz‐TDS], reflectometry, interferometry, ellipsometry, stimulated Brillouin scattering [SBS], self‐mixing interferometry [SMI], chromatic confocal microscopy [CCM], infrared thermography) categories with the conclusion of reflectometry, interferometry, and ellipsometry being the most suitable methods for in‐line characterization.…”