Abstract:Three-dimensional (3D) electronic systems enable higher integration densities compared to their 2D counterparts, a gain required to meet the demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile devices and other emerging technologies. Through-silicon vias (TSVs) open a pathway to integrate electrical connections for signaling and power delivery through the silicon (Si) carrier used in 3D-stacked microstructures. As a limitation, TSVs induce locally thermomechani… Show more
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