CP based EBDW throughput enhancement for 22nm high volume manufacturing

Maruyama, Takashi; Machida, Yasuhide; Sugatani, Shinji

doi:10.1117/12.846492

Cited by 6 publications

(12 citation statements)

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“…CASCO performs much better than the published state of the art [8] and [9] mainly because it exploits the flexibility in the location of a character pattern within its effective printing region. Finally, we note that CASCO can be applied to the stencil design of a multi-beam system [1], [2]. In a multi-beam system, multiple beam columns furnished with their own stencils write different regions of a wafer in parallel.…”

Section: Discussionmentioning

confidence: 99%

“…Since character projection can significantly reduce the shot count, which is directly proportional to the writing time, the throughput of e-beam writing system can be significantly improved. Besides, the throughput of shooting a wafer can be further increased by employing a multi-beam system [1], [2]. In conventional stencil design, characters are placed in a regular 2-D array on the stencil as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…We want to point out that the character projection systems actually allow the pattern of a character to be located anywhere within its enclosing projection region as long as they are not too close to the boundary. 1 Hence, we propose a new problem of character and stencil co-optimization with blank space sharing for a cellbased chip in which we exploit this flexibility to co-optimize the character and stencil design. Our main contributions are summarized as follows.…”

Section: Introductionmentioning

confidence: 99%

“…To extend Moore's law, different solutions like extensions of 193 immersion with multiple patterning, extreme ultraviolet (EUV) lithography, directed self-assembly (DSA), nanoimprint, and electron beam (e-beam) lithography [1]- [3] are being explored by the semiconductor industry. E-beam lithography directly shoots e-beams onto a wafer to define nanometer structures of a circuit.…”

Section: Introductionmentioning

confidence: 99%

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E-Beam Lithography Character and Stencil Co-Optimization

Mak

Chu

2014

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Electron-beam maskless lithography is being actively explored by the semiconductor industry for chip production in the sub-22nm regime. Character projection allows in one ebeam shot the printing of complex pattern rather than merely a single rectangle or triangle as in variable-shaped beam projection. However, those circuit patterns that do not match any character on the stencil still have to be written by variable-shaped beam projection. We investigate a new problem of character and stencil co-optimization with blank space sharing between characters so as to minimize the total number of shots required for printing a circuit. We exploit the fact that the blank spaces on the sides of a character can be adjusted by moving the pattern to be printed within its projection region to facilitate blank space sharing so as to pack more characters into the stencil. Even though the co-optimization problem is shown to be NP-complete, we are able to design an elegant approximation algorithm, CASCO. Experiments confirm that the solutions by CASCO are nearly optimal. Compared to the published state of the art, CASCO reduces the shot count by 1.59× while it is also orders of magnitude faster.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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E-Beam Lithography Character and Stencil Co-Optimization

Mak

Chu

2014

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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“…In CP technology, every pattern is a pre-designed character, and a stencil contains all characters for projection. Moreover, EBL has the capability [4] [5] to mask a character on stencil and project only a desired rectangular region of the character without the white space restriction. This capability [4] increases the possible structures by a character.…”

Section: Introductionmentioning

confidence: 99%

Character design and stamp algorithms for Character Projection Electron-Beam Lithography

Zhao

Weng

et al. 2012

17th Asia and South Pacific Design Automation Conference

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In this paper, we propose a series of methods, including character design, stencil compaction and layout matching for Character Projection (CP) Electron-Beam Lithography. We solve the problems with emphasis on inter-cell routing including wires and vias. For wire layout, we design a small set of regular characters after layout normalization. Then we partition the layout into several rows and adopt a greedy algorithm for layout matching in each row. For via layout, we utilize a minimum path covering algorithm to group vias into paths, which are contained in characters with bounded length. We devise an efficient method to compact all characters into a stencil with much less area than the total area of characters. Experimental results show that our algorithms achieve up to 83.42% and 67.29% of the maximum improved-throughput by CP against to Variable Shaped Beam (VSB) technology for wire and via layouts, respectively. Our characters can apply for general purpose layouts to save the high cost of generating different stencils for different layouts.

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