2020
DOI: 10.1016/j.elecom.2020.106823
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Defect-free metallization of through-glass vias with engineered geometry in additive-free electrolyte

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Cited by 6 publications
(1 citation statement)
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“…As an example, this can take advantage of recent developments in TGV metallization. [4,5] This overall approach is based on fabricating TFT structures before via metallization. Alternative approaches based on fabricating TFTs after via metallization will be discussed in subsequent reports.…”
Section: Approachmentioning
confidence: 99%
“…As an example, this can take advantage of recent developments in TGV metallization. [4,5] This overall approach is based on fabricating TFT structures before via metallization. Alternative approaches based on fabricating TFTs after via metallization will be discussed in subsequent reports.…”
Section: Approachmentioning
confidence: 99%