High-speed, High-density, and Highly-manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Systems

Kawamura, Hiroshi; Takano, Takamasa; Akazawa, Miyuki; Yamada, Shouhei; Sakamoto, Kouji; Kitayama, Daisuke; Iida, Haruo; Tanaka, Masaya; Tai, Takahiro

doi:10.1109/ectc32696.2021.00169

Cited by 6 publications

(1 citation statement)

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“…A design concept of glass panel embedding technology was proposed; it embeds the concerned chip in the glass substrates with plated RDL and TGV to achieve a trace below 2 μm by adopting polymer RDL, providing a solution for warpage control [ 38 ]. Cu bridge design improves upon conformal Cu-filled via structures and has superior reliability against thermal stress [ 39 ].…”

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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Section: Introductionmentioning

confidence: 99%