amorphous IGZO (a-IGZO) TFT was fabricated by Hosono and coworkers and presented impressive electron mobility and current on/off ratio. [10,11] Taking advantage of their excellent optical transparency, high mechanical flexibility, and especially low-temperature process feasibility, the amorphous oxide semiconducting (AOS) TFTs have triggered large scientific interests and industrial benefits, and can be widely used in active-matrix liquid crystal display, bio-and optical sensing fields, etc. [12] However, disordered structural network and high density of intrinsic defects in the AOS materials largely affect electrical performances (e.g., electron mobility and stability) of the TFTs and limit their industrial applications in next-generation electronic device platforms. To overcome these limitations, a notable strategy, i.e., stackedlayer channel combining different individual oxide semiconducting materials, has been proposed in recent years and successfully implemented to enhance the device performances. [13][14][15][16][17][18][19] Park and Lee reported a bilayer IZO/IGZO TFT with the field-effect mobility (μ FE ) of 47.7 cm 2 V −1 s −1 and threshold voltage (V TH ) of 1.57 V, where the mobility enhancement (i.e., ≈2.3 times higher than that of a single-layer IGZO TFT) was induced by a high electron density of the IGZO layer with electrons injected from the IZO layer of the stacked structure. [13] Liu et al. presented Here, the bilayer InGaZnO/In 2 O 3 thin-film transistors (TFTs) are deposited by radio-frequency magnetron sputtering at room temperature. A high field-effect mobility (μ FE ) of 64.4 cm 2 V −1 s −1 and a small subthreshold swing (SS) of 204 mV per decade are achieved in the bilayer-stack TFTs fabricated upon SiO 2 /Si substrate, with large improvement compared to the singlelayer InGaZnO and In 2 O 3 TFTs. Implementing HfO 2 and Si 3 N 4 as high-k gate dielectrics, μ FE and SS are correspondingly enhanced to be 67.5 and 79.1 cm 2 V −1 s −1 , and 85 and 92 mV per decade in the bilayer TFTs. Defect self-compensation effect is also revealed, i.e., (In) + + (O) − → In − O, while, respectively, considering the indium-and oxygen-related defects in InGaZnO and In 2 O 3 and exploring the numerical simulations in SILVACO/Atlas (for electrical performance) and Quantum Espresso (for physical analysis). The InO formation can result in a significant reduction in defect density (validated by the X-ray photoelectron spectra and low-frequency noise characterizations) and therefore improvement of μ FE and SS in the bilayerstack TFT. The important role of defect self-compensation mechanism while combining different individual channel layers in the oxide semiconducting TFTs is underlined and highly potential application in next-generation, fast-speed flexible displays is shown.