Design and Fabrication of Stretchable Multilayer Self-Aligned Interconnects for Flexible Electronics and Large-Area Sensor Arrays Using Excimer Laser Photoablation

Lin, Kevin L.; Jain, Kanti

doi:10.1109/led.2008.2008665

Cited by 55 publications

(40 citation statements)

References 15 publications

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“…[53][54][55][56][57][58][59]61,[62][63][64][65][66][67][68][69][70][71][72] This approach, which receives inspiration from Whitesides et al [62] who observed that thin films of Au deposited onto PDMS form wavy, buckled shapes, represents the basis of some of the original work in stretchable electronics. Stretchability derives from the mechanics of such metal structures, which electrically interconnect separately fabricated, rigid active device regions that remain flat and non-stretched.…”

Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

“…[67] A different, but related type of stretchable electrode involves S-shaped serpentine patterns of metal lines fabricated on a carrier wafer and then embedded in PDMS by encapsulation and transfer. [55][56][57][58][59]61] Deformations of these initially planar structures occur primarily at the curved edges of the serpentines, to accommodate applied strain (e.g., Fig. 3c).…”

Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

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Stretchable, Curvilinear Electronics Based on Inorganic Materials

et al. 2010

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All commercial forms of electronic/optoelectronic technologies use planar, rigid substrates. Device possibilities that exploit bio-inspired designs or require intimate integration with the human body demand curvilinear shapes and/or elastic responses to large strain deformations. This article reviews progress in research designed to accomplish these outcomes with established, high-performance inorganic electronic materials and modest modifications to conventional, planar processing techniques. We outline the most well developed strategies and illustrate their use in demonstrator devices that exploit unique combinations of shape, mechanical properties and electronic performance. We conclude with an outlook on the challenges and opportunities for this emerging area of materials science and engineering.

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Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

Stretchable, Curvilinear Electronics Based on Inorganic Materials

et al. 2010

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“…Young's moduli and Poisson's ratios for the three layers are E t , E m and E b , and ν t , ν m and ν b , respectively. Due to the fact that the structure for flexible electronics is long and thin ( Jia et al, 2011;Lee and Liu, 2014;Lin and Jain, 2009;Yu et al, 2013 ), the top and bottom layers behave as the slender beams and the model is known as the Euler-Bernoulli beam ( Timoshenko, 1930 ). The soft middle layer is modeled as the shear lag which only accounts for the shear deformation; its validity will be discussed later.…”

Section: Given Slopes Are Imposed At the Ends Of The Hard Layersmentioning

confidence: 99%

Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics

Liu

et al. 2017

International Journal of Solids and Structures

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a b s t r a c tFlexible electronics has attracted much attention in recent years due to the favorable applications to many emerging devices. A novel laminated structure for a new-generation of flexible electronics is composed of several thin layers, where the hard functional components are built, glued by soft adhesives. To prevent the premature mechanical failure and to achieve the best performance of the electronics, the structural design of such a laminate is of crucial importance. Accordingly, it is necessary to establish an analytic model to accurately describe the mechanical behavior of the laminated structure. The available models fall into two categories: those only taking into account the normal strain-induced deformation of the soft adhesive layers and those only incorporating the shear deformation of the same layers. This paper aims to quantitatively figure out which deformation dominates. By establishing an accurate enough analytic model, a significant finding is revealed that shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics while the normal strain-induced deformation is negligible. The model is well validated by the finite element method (FEM). The effects of the membrane energy and bending energy of the soft layer are also investigated by incorporating or neglecting the shear energy. The model accurately captures the key quantities such as the strain distribution in each layer and the locations of the neutral mechanical planes of the top and bottom layers. This work is expected to provide the design guidelines for the laminated structure-based flexible electronics.

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“…Recently, many types of interesting approaches have been actively researched and developed. Flexible displays (Gelinck & Leeuw, 2004;Park J. S. et al, 2009), radio-frequency flexible identification tags (Forrest, 2004;Jung M. et al, 2010), flexible and stretchable sensor arrays (Lin K. & Jain, 2009;Someya et al, 2005), flexible electronic circuit systems (Graz & Lacour, 2009;Zschieschang et al, 2010), stretchable lightings (Sekitani et al, 2009a), printable devices (Ishida et al, 2010), and sheet-type communication and power-transmission system (Sekitani et al, 2009b) are the feasible examples. In order to develop the practical systems using these devices, an embeddable nonvolatile memory is strongly required as one of the core devices.…”

Section: Introductionmentioning

confidence: 99%