Design of conducting paths based on topology optimization

Zhang, Yongcun; Liu, Shutian

doi:10.1007/s00231-007-0365-1

Cited by 79 publications

(21 citation statements)

References 18 publications

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“…There have been works done in the past on finding optimal microfluidic networks to minimize various cost functions, similar to this problem. Some of them are [8,9,10]. You could adapt the principles described in these papers to find the optimal design for this problem.…”

Section: Evaluation Methodologymentioning

confidence: 99%

ICCAD 2015 contest in 3D interlayer cooling optimized network

Sridhar¹,

Sabry²,

Atienza³

2015

2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electrical demonstrations of microchannel liquid-cooled heat sinks on the back side of IC dies exist in the literature and the compatibility of its fabrication with the existing CMOS process has been shown. This compatibility also gives rise to the prospect of building of nearly an infinite variety of channel networks with no additional manufacturing cost. This ICCAD 2015 problem aims to identify methods to optimize such microchannel fluid networks, and to evaluate impact of different cooling networks on different computing architectures floorplans.

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Section: Evaluation Methodologymentioning

confidence: 99%

ICCAD 2015 contest in 3D interlayer cooling optimized network

Sridhar¹,

Sabry²,

Atienza³

2015

2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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“…One case was presented to elaborate the difference and the effect of this assumption. Zhang and Liu [69] mentioned a new method for designing heat-conducting paths based on SIMP. This is related to a later publication mentioned in 2011.…”

Section: -2010mentioning

confidence: 99%

Heat Exchanger Design with Topology Optimization

Manuel¹,

Lin²

2017

Heat Exchangers - Design, Experiment and Simulation

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Topology optimization is proving to be a valuable design tool for physical systems, especially for structural systems. However, its application in the field of heat transfer is less evident but is constantly progressing. In this chapter, we would like to introduce topology optimization in the context of heat exchanger design to the general reader. We also provide a chronological review of available literature to see the current progress of topology optimization in the field of heat transfer and heat exchanger design. We expect that topology optimization will prove to be a valuable tool in heat exchanger design for the coming years.

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“…Li et al [2] developed a computational procedure based on FEM and ESO for the topology design of heat conduction in isotropic fields. Zhang and Liu [3] developed a new method based on topology optimization for solving heat conduction problems for isotropic media with distributed heat sources. This method was able to reconstruct the conducting paths by distributing high conductive materials.…”

Section: Introductionmentioning

confidence: 99%

A topological optimization procedure applied to multiple region problems with embedded sources

Anflor

Albuquerque

Wrobel

2014

International Journal of Heat and Mass Transfer

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The main objective of this work is the application of the topological optimization procedure to heat transfer problems considering multiple materials. The topological derivative (D T ) is employed for evaluating the domain sensitivity when perturbed by inserting a small inclusion. Electronic components such as printed circuit boards (PCBs) are an important area for the application of topological optimization. Generally, geometrical optimization involving heat transfer in PCBs considers only isotropic behaviour and/or a single material. Multiple domains with anisotropic characteristics take an important role on many industrial products, for instance when considering PCBs which are often connected to other components of different materials. In this sense, a methodology for solving topological optimization problems considering anisotropy and multiple regions with embedded heat sources is developed in this paper. A direct boundary element method (BEM) is employed for solving the proposed numerical problem.

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Design of conducting paths based on topology optimization

Cited by 79 publications

References 18 publications

ICCAD 2015 contest in 3D interlayer cooling optimized network

ICCAD 2015 contest in 3D interlayer cooling optimized network

Heat Exchanger Design with Topology Optimization

A topological optimization procedure applied to multiple region problems with embedded sources

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