Despite much attention for forming a uniform oxide film
with a
few atomic layers in modern Si semiconductor industry, the surface
distribution and the chemical analysis of oxides have not been clear.
In situ observation of an Si(111)-7 × 7 surface during exposing
to O2 at 300 K was carried out using X-ray photoelectron
spectroscopy, low-energy electron diffraction, and scanning tunneling
microscope. Atomic lineation of products on the Si adatoms in the
faulted-half side of the Si(111)-7 × 7 surface was revealed.
We clarified that the minimum thickness of the oxide film, which covers
the overall Si surface, was 0.35 nm. This study provides the physical
picture of oxide-film formation mechanisms, which involves a mobile
O2 on the surface and suggests the possibility to fabricate
1D atomic oxides.