ASAP 2011 - 22nd IEEE International Conference on Application-Specific Systems, Architectures and Processors 2011
DOI: 10.1109/asap.2011.6043279
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Domain-specific processor with 3D integration for medical image processing

Abstract: Abstract-The growth of 3D technology had led to opportunities for stacked multiprocessor-accelerator computing platforms with highbandwidth and low-latency TSV connections between them, resulting in high computing performance and better energy efficiency. This work evaluates the performance and energy benefits of such an advanced architecture and addresses associated design problems. To better utilize the reconfigurable hardware resource and to explore the opportunity of kernel sharing across applications, we … Show more

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Cited by 10 publications
(4 citation statements)
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“…We evaluate our framework using two core image processing algorithms for 3D MRI, denoise and segmentation. These algorithms are taken from the CPU implementation of the CDSC medical imaging pipeline [1,16,17]. We also evaluate 2 benchmarks from the PolyBench/C test suite, representative of compute-bound and memory-bound numerical kernels.…”
Section: Methodsmentioning
confidence: 99%
“…We evaluate our framework using two core image processing algorithms for 3D MRI, denoise and segmentation. These algorithms are taken from the CPU implementation of the CDSC medical imaging pipeline [1,16,17]. We also evaluate 2 benchmarks from the PolyBench/C test suite, representative of compute-bound and memory-bound numerical kernels.…”
Section: Methodsmentioning
confidence: 99%
“…1 Since functions in one block work serially, they can share one memory block without conflicts. That is, the function with the largest memory area determines A mem i,j .…”
Section: ) Function Parametersmentioning
confidence: 99%
“…Domain-specific FPGA accelerators are gaining popularity in heterogeneous multiprocessor systems-on-chip (MPSoCs) [1], [2]. Such accelerators have the potential to provide orders of magnitude improvements in both energy consumption and execution time.…”
Section: Introductionmentioning
confidence: 99%
“…Our proposed system model is a 3D integration of a Field-Programmable Gate Array (FPGA) atop a standard chip multiprocessor (CMP), with Through-Silicon Vias (TSVs) as the communication medium between the two layers ( Figure 1) -a more detailed description of the architecture can be found in [4]. Through 3D integration using TSVs, our design provides efficient and direct CMP-FPGA communication.…”
Section: Introductionmentioning
confidence: 99%