Chip Multiprocessors (CMPs)

This paper describes an unconventional way to apply wireless networking in emerging technologies. It makes the case for using a two-tier hybrid wireless/wired architecture to interconnect hundreds to thousands of cores in chip multiprocessors (CMPs), where current interconnect technologies face severe scaling limitations in excessive latency, long wiring, and complex layout. We propose a recursive wireless interconnect structure called the WCube that features a single transmit antenna and multiple receive antennas at each micro wireless router and offers scalable performance in terms of latency and connectivity. We show the feasibility to build miniature on-chip antennas, and simple transmitters and receivers that operate at 100 − 500 GHz sub-terahertz frequency bands. We also devise new two-tier wormhole based routing algorithms that are deadlock free and ensure a minimum-latency route on a 1000-core on-chip interconnect network. Our simulations show that our protocol suite can reduce the observed latency by 20% to 45%, and consumes power that is comparable to or less than current 2-D wired mesh designs.

This work discusses a hardware architectural support for acceleratorrich CMPs (ARC). First, we present a hardware resource management scheme for accelerator sharing. This scheme supports sharing and arbitration of multiple cores for a common set of accelerators, and it uses a hardware-based arbitration mechanism to provide feedback to cores to indicate the wait time before a particular resource becomes available. Second, we propose a light-weight interrupt system to reduce the OS overhead of handling interrupts which occur frequently in an accelerator-rich platform. Third, we propose architectural support that allows us to compose a larger virtual accelerator out of multiple smaller accelerators. We have also implemented a complete simulation tool-chain to verify our ARC architecture. Experimental results show significant performance (on average 51X) and energy improvement (on average 17X) compared to approaches using OS-based accelerator management.

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As chip multiprocessors scale to a greater number of processing cores, on-chip interconnection networks will experience dramatic increases in both bandwidth demand and power dissipation. Fortunately, promising gains can be realized via integration of Radio Frequency Interconnect (RF-I) through on-chip transmission lines with traditional interconnects implemented with RC wires. While prior work has considered the latency advantage of RF-I, we demonstrate three further advantages of RF-I: (1) RF-I bandwidth can be flexibly allocated to provide an adaptive NoC, (2) RF-I can enable a dramatic power and area reduction by simplification of NoC topology, and (3) RF-I provides natural