Duty cycle dependent pulsed IV simulation and thermal time constant model fitting for LDMOS transistors

Meena, Sivalingam Somasundaram; Baylis, Charles; Dunleavy, L.P.; Marbell, M.N.

doi:10.1109/arftg74.2009.5439093

Cited by 3 publications

(1 citation statement)

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“…The latter would be under a variable temperature at a significantly lower average. [6][7][8] Heat, which was generated at such a small length scale, is dissipated at larger length scales, going from chip to package, PCB and system levels. Evidently, this entails other much large time constants.…”

Section: Qualitative Estimates Of Thermal Time Constants At the Devicmentioning

confidence: 99%

Techniques to Create Compact Thermal Models — Dynamic Problems

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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Many business objectives related to performance, functionality, reliability and safety are affected by temperature. Most reliability protocols at present consider the steady state temperature the only stressor affecting reliability. Consequently, system designers often use temperature reduction as the primary means to improve reliability. However, is the steady state temperature indeed the dominant parameter? There is ample evidence that temperature gradients in space and time are far more important than the absolute temperature (see e.g. Lall et al., 1 Pecht, 2 Parry et al. 3 ). Section 7.2 will discuss a number of application fields for which time-dependent temperature measurements or predictions become increasingly important.Although a growing awareness of the importance of dynamic thermal effects has been lately noticed, the large majority of electronic system designers still believe that time constants of thermal effects are huge compared to those of electronic systems and hence, steady thermal analysis should be sufficient. This last statement is not always true. In fact, as will be proven both qualitatively and quantitatively in this chapter, there is an infinite set of thermal time constants. Some of them are quite comparable to those of electronic phenomena; others are quite larger. Whether or not should one consider dynamic thermal effects, depends on which problem is addressed.This chapter starts with a quick overview of cases where dynamic effects may be important. Then, fundamental aspects of transient modeling will first be introduced for a simple transient one-dimensional problem in order to gain physical understanding about basic notions involved. This will be followed by a well-known application: the structure function. It will then be generalized to fixed profile 3D problems. Next, a review of methods is proposed for constructing Dynamic Compact Thermal Models (DCTM). A general theoretical framework for transient problems with variable profiles will follow based on the same ideas given above for static problems. Some extensions will be briefly addressed in the last section.

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Section: Qualitative Estimates Of Thermal Time Constants At the Devicmentioning

confidence: 99%