Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Chang, Shih‐Ying; Jain, Chao‐Chi; Chuang, Tung‐Han; Feng, Long; Tsao, L. C.

doi:10.1016/j.matdes.2011.06.044

Cited by 121 publications

(76 citation statements)

References 20 publications

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“…1) indicates a single sharp endothermic peak which is the melting temperature of T M =218.98ºC, 0.9% higher than the eutectic temperature of a typical SAC due to different atmosphere medium, nitrogen used in this DSC test. Compared to other researchers, the melting temperature of SAC was <2.6°C [27], <2.22°C [28,29], <2.35°C [11] and <4.62°C [30] respectively. This lower melting temperature of SAC compared to others is due to the different mass percentage of elements (3.5%Ag and 0.8%Cu) used in this research which gives a temperature of approximately 218-219°C as in the phase diagram.…”

Section: Melting Propertiescontrasting

confidence: 74%

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh

Noor

2015

MATEC Web of Conferences

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Abstract. Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC) solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of, T M=227°C which is below the desired soldering temperature, T M=250°C. Besides, this SAC solder produces well-defined microstructures with Sn-matrix and eutectic phase consisting Cu 6Sn5 and Ag3Sn displayed from SEM image, contributes in harvesting good mechanical properties. The SAC solder also provides a high hardness value with an average of 14.4Hv for Vickers hardness. All these results seem to satisfy the need of a viable solder alloy.

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Section: Melting Propertiescontrasting

confidence: 74%

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh

Noor

2015

MATEC Web of Conferences

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“…These studies found a good agreement with the previous research regarding the reinforcement of nanoparticles in the solder matrix. Tsao et al [14], Chang et al [13], Gain et al and co-authors [15,[22][23][24] reported that the addition of a small percentage of nanoparticles slightly increased both liquidus and solidus temperatures of SAC composite solders. Table 1 summarizes the detailed evidence of the previous studies performed via DSC scans.…”

Section: 1mentioning

confidence: 99%

“…7). Several researchers [6,13,17,26,27] investigated these phenomena regarding the growth of IMCs that were retarded by reinforcement of nanoparticles. However, a few studies had reported that the individual addition of periodic 4 ferrous elements, such as cobalt and nickel into a solder matrix, increased the thickness of the IMC layers [6,28,29].…”

Section: Intermetallic Layermentioning

confidence: 99%

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Chellvarajoo

Abdullah

Samsudin³

2015

Materials & Design

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“…Importantly, with the advancement in the nanotechnology, many new nanoparticles have been synthesized and used as the dispersed phases in the solders (i.e., the nanocomposite solders) to enhance their mechanical properties [10]. However, the improvement in the fatigue strength and creep resistance comes with the alteration of the other properties of the solder, such as wettability and microstructure [11][12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Cited by 121 publications

References 20 publications

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

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