2019 International Conference on Innovative Trends and Advances in Engineering and Technology (ICITAET) 2019
DOI: 10.1109/icitaet47105.2019.9170219
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Effect of Annealing Temperature on Switching Characteristics of Zinc Oxide based RRAM Device

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Cited by 4 publications
(3 citation statements)
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“…2. SIMNRA is mainly intended for the simulation of spectra with non-Rutherford backscattering cross-sections The SIMNRA simulation [15][16][17][18][19] is used to fit the spectrum and to determine the thickness of the film and zinc, oxygen atomic fraction. From the SIMNRA simulation, the zinc atomic fractions were estimated to be 60.0% and oxygen 40.0 % and Zinc oxide film thickness of 140 ± 10 nm.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…2. SIMNRA is mainly intended for the simulation of spectra with non-Rutherford backscattering cross-sections The SIMNRA simulation [15][16][17][18][19] is used to fit the spectrum and to determine the thickness of the film and zinc, oxygen atomic fraction. From the SIMNRA simulation, the zinc atomic fractions were estimated to be 60.0% and oxygen 40.0 % and Zinc oxide film thickness of 140 ± 10 nm.…”
Section: Resultsmentioning
confidence: 99%
“…As grown substrate was characterized for the surface characterization properties showing uniform and crack-free deposition of ZnO. 15,16 Gold 200 Å thick was placed by DC sputtering using a shadow mask. Before gold is deposited, a coating of titanium (15 nm) is deposited to make the gold more adherent to the annealed oxide layer.…”
Section: Methodsmentioning
confidence: 99%
“…As mentioned above, as the conductive filaments are generally composed of defects, such as Sn vacancies or O interstitials, the defect adjustment has a great impact on the switching behavior. There are representative methods for controlling the defect such as annealing treatment, which changes the phase of crystalline [ 17 , 18 , 19 , 20 ], and plasma treatment using chemical gases, like Ar [ 21 , 22 , 23 , 24 , 25 ], O 2 [ 26 , 27 , 28 ], and N 2 [ 29 , 30 ]. Far from an annealing process that can be engaged with the thermal budget issue with the CMOS fabrication process, plasma treatment that causes only small damage on the surface is certainly a useful processing technique.…”
Section: Introductionmentioning
confidence: 99%