“…As mentioned above, as the conductive filaments are generally composed of defects, such as Sn vacancies or O interstitials, the defect adjustment has a great impact on the switching behavior. There are representative methods for controlling the defect such as annealing treatment, which changes the phase of crystalline [ 17 , 18 , 19 , 20 ], and plasma treatment using chemical gases, like Ar [ 21 , 22 , 23 , 24 , 25 ], O 2 [ 26 , 27 , 28 ], and N 2 [ 29 , 30 ]. Far from an annealing process that can be engaged with the thermal budget issue with the CMOS fabrication process, plasma treatment that causes only small damage on the surface is certainly a useful processing technique.…”