Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint

Wang, Jianhao; Xue, Songbai; Zhang, Peng; Wang, Ziyi; Zhai, Peizhuo

doi:10.1007/s10854-019-02656-4

Cited by 11 publications

(3 citation statements)

References 35 publications

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“…Sn-based solder alloys with excellent properties are widely used in electronic packaging, and a few novel Sn-based solder alloys that are applied in the packaging of integrated circuits (IC) have been designed to meet the rising requirement of electrical devices, thanks to the researchers [4][5][6]. Recently, owing to the development of electronics industry, the high-density packaging technologies for integrated circuits (IC), such as BGA, CSP, IGBT, and WLP, have been applied gradually, promoting the upgrading and miniaturizing process of electrical products [7,8]. But miniaturization of ICs with higher power also results in increasingly higher service temperature of more than 300 °C, which puts much emphasis on the electrical devices as well as their packaging materials [9].…”

Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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“…Additionally, to further reveal the morphology of the interfacial IMC layer, a nitric acid alcohol solution was used to remove the solder of some joint samples to expose the interface IMC grains, and the changes in the interfacial microstructure of the solder joints were characterized more accurately combined with the cross-sectional morphology. The corrosion method has been introduced in the literature [8].…”

Section: Methodsmentioning

confidence: 99%

“…A recent study [7] reveals that adding a small amount of Sb can significantly improve the reliability of a solder, and a significant improvement effect can be achieved with 1.0 wt % of Sb addition, while an excessive Sb addition will embrittle the solder. For the SnPbSb solder, investigations reveal that thermal cycling of −65~150 • C not only increases the thickness of the intermetallic compound (IMC) layer at the joint interface, but also decreases the strength of the SnPbSb/Cu solder joint, while the thermal shock at −196~150 • C will result in microcracks at the SnPbSb/Cu joint interface and deteriorate the performance of the solder joints [4,8]. Therefore, it can be considered that the SnPbSb/Cu solder joint is sensitive to its service environment, and it is necessary to clarify the influences of service environments on the microstructure and properties of the SnPbSb/Cu solder joints to ensure the reliable application of the SnPbSb solder.…”

Section: Introductionmentioning

confidence: 99%

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Zhou

et al. 2022

Crystals

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With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing. In this study, a SnPbSb solder with excellent wettability was used as the research object, and the effects of high-temperature aging at 150 °C on the microstructure and mechanical properties of SnPbSb/Cu solder joints were investigated according to the relevant industry standards. It was found that high-temperature aging does not change the eutectic structure of the SnPbSb solder, but it does significantly coarsen the Sn-rich phase and the Pb-rich phase in the solder. In addition, the interfacial intermetallic compound (IMC) layer in the SnPbSb/Cu solder joint changes from a Cu6Sn5 single layer to a Cu6Sn5/Cu3Sn double layer after the aging, and the thickness of the IMC layer increases greatly. High-temperature aging significantly deteriorates the mechanical properties of the solder joints. After aging at 150 °C for 1000 h, the shear strength of the SnPbSb/Cu solder joints decreased by 45.39%, while the ductile fracture mode did not change.

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Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

Wang

Xue

Wang

et al. 2020

J Mater Sci: Mater Electron

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Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint

Cited by 11 publications

References 35 publications

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

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