Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

Ramli, Mohd Izrul Izwan; Saud, Norainiza; Salleh, Mohd Arif Anuar Mohd; Derman, Mohd Nazree; Said, Rita Mohd

doi:10.1016/j.microrel.2016.08.011

Cited by 63 publications

(26 citation statements)

References 43 publications

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“…The addition of the TiO2 nanoparticles significantly refined the Ag3Sn and Cu6Sn5 particles (Figure 10a-b) and the heterogonous nucleation provided more homogeneous distribution of the IMC phases [32]. Thus, at the CS-2 cross-section, the dislocation movements induced by the applied force faced to higher obstacles during the force distribution due to the finer and well distributed Ag3Sn and Cu6Sn5 particles.…”

Section: Mechanism Of Horizontal Hardness Improvement Of the Sac305-1mentioning

confidence: 97%

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Nasir

Yahaya

Erer

et al. 2019

Ceramics International

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The improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt. % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt. % TiO2 nanoparticles improved the hardness values up to 26.2 % than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples.

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Section: Mechanism Of Horizontal Hardness Improvement Of the Sac305-1mentioning

confidence: 97%

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Nasir

Yahaya

Erer

et al. 2019

Ceramics International

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“…Traditional SnPb solders were widely used in electronic packaging because of low cost and excellent performance. However, due to the toxicity of lead, most countries have implemented a series of laws such as waste electrical and electronic equipment (WEEE) and restriction of hazardous substances (RoHS), to restrict the use of lead in various electronic and electrical products [2].…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

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With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

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“…Recently, there are many studies focused on developed composite solder by addition ceramic particles [4]. S.M.L.…”

Section: Introductionmentioning

confidence: 99%

“…The ceramic reinforcing material such as Si3N4 has also been studied by Ramli et al [6] and Mohd Salleh et al [7] and they reported that mechanical properties of composite solder has improved significantly by using powder metallurgy technique. However, the limitation of ceramic particles into solder is (i) homogeneous distribution of ceramic particles in a solder matrix is hard to be achieved, (ii) a high amount of ceramic particles may increase the brittleness of solder and (iii) ceramic additions do not normally stay in the solder during reflow, and are almost completely expelled with flux [4]. By these reason, powder metallurgy was introduce and become the most common method used in developing composite solders.…”

Section: Introductionmentioning

confidence: 99%

Thermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder

Ramli¹,

Salleh²,

Said³

et al. 2017

AIP Conference Proceedings

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ARTICLES YOU MAY BE INTERESTED INAbstract. The influence of ceramic addition on the Sn-Cu-Ni solder alloy on thermal and mechanical properties has been investigated. The results revealed that a small amount of SiC has not effect on typical soldering process but improved the hardness of the composite solder. Small dimples and rough surface in fracture surface show that SnCu-Ni composite solder exhibited typical ductile failure which has increased the shear strength value. Overall, it is concluded that Sn-Cu-Ni has shown superior mechanical properties by the addition of SiC particulates.

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Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

Cited by 63 publications

References 43 publications

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Thermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder

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