Effect of Tool Rake Angle and Crystal Orientation on Ductile Mode Cutting of Hard/Brittle Materials

Abdelkawy, Abdallah; Yoshino, Masahiko; Nakagawa, Yuki

doi:10.20965/ijat.2020.p0253

Cited by 4 publications

(2 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…At present, ductile-mode machining has become an ultra-precision processing method for brittle materials to avoid fracture defects [4,5]. Studies show that when the cutting depth is very small, ductile chips will be formed in brittle materials during processing, and the material removal mode is ductile machining [6,7].…”

Section: Introductionmentioning

confidence: 99%

An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

Guo

Yuan

et al. 2022

Micromachines

View full text Add to dashboard Cite

Understanding the influence mechanism of abrasive/tool wear on machining is the key to realize high-efficiency ultra-precision machining of fused silica. To explore the effect of abrasive/tool wear on ductile machining, the smoothed particle hydrodynamics (SPH) cutting models with different edge radii are established. Through the analysis of equivalent rake angle, hydrostatic pressure, cutting force and maximum principal stress with the Flamant’s formula, the influence of edge radii on ductile-brittle transition (DBT) is discussed for the first time. The simulation results show that when the edge radius increases from less to larger than the cutting depth, the equivalent rake angle changes from positive to negative, and the maximum hydrostatic pressure gradually increases, which is beneficial to promote the ductile processing. Meanwhile, with the rise of edge radius (i.e., abrasive/tool wear), both the cutting force and crack initiation angle increase, while the friction coefficient and normalized maximum principal decrease. When the value of normalized maximum principal stress exceeds 2.702, the crack in the workpiece begins to initiate, and its initiation angle calculated by the Flamant’s formula is in good agreement with the simulation results as well as less than 50°. Finally, the nano-scratch experiment was carried out, and the material removal mechanism and friction coefficient f similar to the simulation were obtained, which further proved the accuracy of SPH model. This study is meaningful for understanding the effect of abrasive/tool wear on the removal mechanism of brittle materials and improving the quality and efficiency of cutting and grinding.

show abstract

Section: Introductionmentioning

confidence: 99%

An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

Guo

Yuan

et al. 2022

Micromachines

View full text Add to dashboard Cite

show abstract

“…Nanoscratch is becoming a promising characterization method to analyze wear behavior and the nano-tribological property of a material under the dynamic state [ 14 , 15 ]. However, there are few studies focused on the machining anisotropy of monocrystalline sapphire in the ductile-regime by nanoscratch or similar methods which have clarified particularly the effect of the tool rake angle [ 16 ] and the slip/twinning systems [ 17 ] on the deformation states—even though it is important to clarify the deformation and removal mechanisms including the anisotropy, which are particularly concerned with the machining efficiency and machined surface and sub-surface qualities.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal

et al. 2021

View full text Add to dashboard Cite

In this study, single groove nanoscratch experiments using a friction force microscope (FFM) with a monocrystalline diamond tip were conducted on a c-plane sapphire wafer to analyze the ductile-regime removal and deformation mechanism including the anisotropy. Various characteristics, such as scratch force, depth, and specific energy for each representative scratch direction on the c-plane of sapphire, were manifested by the FFM, and the results of the specific scratch energy showed a trend of six-fold symmetry on taking lower values than those of the other scratch directions when the scratch directions correspond to the basal slip directions as 0001⟨112¯0⟩. Since this can be due to the effect of most probably basal slip or less probably basal twinning on the c-plane, a molecular dynamics (MD) simulation of zinc, which is one of the hexagonal close-packed (hcp) crystals with similar slip/twining systems, was attempted to clarify the phenomena. The comparison results between the nanoscratch experiment and the MD simulation revealed that both the specific scratch energy and the burr height were minimized when scratched in the direction of the basal slip. Therefore, it was found that both the machining efficiency and the accuracy could be improved by scratching in the direction of the basal slip in the single groove nanoscratch of c-plane sapphire.

show abstract

Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope

Lin

Shimizu

Zhou

et al. 2022

Precision Engineering

View full text Add to dashboard Cite

Effect of Tool Rake Angle and Crystal Orientation on Ductile Mode Cutting of Hard/Brittle Materials

Cited by 4 publications

References 8 publications

An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal

Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope

Contact Info

Product

Resources

About