Effect of triethanolamine on deposition rate of electroless copper plating

Jiang, Hongyan; Liu, Z. J.; Wang, X. W.; Wang, Z. L.

doi:10.1179/174591907x177543

Cited by 24 publications

(11 citation statements)

References 13 publications

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“…Before the etching treatment, the ABS substrates were pretreated by the degreasing and swelling processes. 13 The ABS substrates were then immersed into the MnO SO 4 ] at 55 °C for 10 min to remove the residual MnO 2 . The surface activation process of the ABS resin was carried out by an activation solution (CATAPOSIT44, purchased from Rohm and Haas Company) at room temperature for 5 min.…”

Section: Methodsmentioning

confidence: 99%

“…The composition of the electroless copper plating solution was the same as mentioned in an earlier report. 13 The pH of the solution was adjusted to 12.5 using sodium hydroxide, and the bath temperature was 70 °C. After electroless plating for 20 min, the electroplating of copper was carried out at room temperature with a current density of 0.03 A/cm 2 for 2 h, which resulted in a copper thickness of 20 μm.…”

Section: Methodsmentioning

confidence: 99%

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Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

2013

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The present study aimed to evaluate the surface etching of the acrylonitrile-butadiene-styrene (ABS) resin in the MnO2-H3PO4-H2SO4 colloid. To enhance the soluble Mn(IV) ion concentration and improve the etching performance of ABS resin, H3PO4 was added as a complexing agent into the MnO2-H2SO4 etching system. The effects of the H2SO4 concentration and etching time on the surface topography, surface roughness, adhesion strength, and the surface chemistry of the ABS substrates were investigated. The optimal oxidation potentials of MnO2 in the colloids decreased from 1.426 to 1.369 V with the addition of H3PO4. Though the etching conditions changed from 70 °C for 20 min to 60 °C for 10 min, the adhesion strength between the ABS substrates and electroless copper film increased from 1.19 to 1.33 KN/m after etching treatment. This could be attributed to the significant increase of the soluble Mn(IV) ion concentration in the MnO2-H3PO4-H2SO4 colloid. The surface chemistry results demonstrated that the oxidation reaction of -C═C- bonds in the polybutadiene phase was accelerated in the etching process by the addition of H3PO4, and the abundant -COOH and -OH groups were formed rapidly on the ABS surface with the etching treatment. These results were in agreement with the results of surface scanning electron microscopic observations and adhesion strength measurement. The results suggested that the MnO2-H3PO4-H2SO4 colloid was an effective surface etching system for the ABS surface roughness.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

2013

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“…Before the electroless silver plating, the surface of the ABS resin laminate was pretreated as done in the literature. [7] The surface activation process of the ABS resin laminate was carried out by an activation solution (CATAPOSIT44, purchased from Rohm and Haas Co.) at 45°C for 5 min, and then the laminate was immersed in 10% hydrochloric acid (HCl) for 1 min. Distilled water was used to wash the laminate after every step.…”

Section: Methodsmentioning

confidence: 99%

Effect of additives on electroless silver plating

Wang¹,

Zhang²,

Zhou³

2016

Proceedings of the 2016 6th International Conference on Machinery, Materials, Environment, Biotechnology and Computer

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Abstract. The effect of DL-Methionine (DM) on the electroless silver deposition was investigated. The deposition rate of electroless silver deposition was inhibited by an addition of DM. The effects of DM on the polarization curves were studied by LSV. Not only the anodic oxidation reaction but also cathodic reduction reaction was inhibited by DM addition. The crystallinity of electroless plated silver film was decreased by an addition of DM.

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“…Surface modification was conducted with a high pressure mercury vapour lamp, which provides the maximum energy at 365 nm. The ABS substrates were first pretreated by the degreasing process, [18] and then were immersed into a TiO 2 dispersed solution. The distance between the substrate surface and the lamp was fixed at 5 cm.…”

Section: Methodsmentioning

confidence: 99%

Surface modification of ABS by photocatalytic treatment for electroless copper plating

Zhao

et al. 2013

Journal of Adhesion Science and Technology

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Surface roughness of acrylonitrile-butadiene-styrene (ABS) resin prior to metallization is treated generally with sulphuric/chromic acid system. However, the presence of chrominum (VI) ion imposes serious environmental problems. In this work, TiO 2 photocatalytic treatment was used to enhance the adhesion strength between the ABS surface and the electroless copper film. Effects of the TiO 2 content, irradiation time and UV power upon the surface topography, surface characterization and the adhesion strength were investigated. The results indicated that the surface hydrophilicity of ABS resin and the adhesion strength between the electroless copper film and ABS surface increased with an increase in the UV power and a prolongation in irradiation time, and did not increase linearly with an increase of TiO 2 content. Though the surface topography of ABS changed little, the adhesion strength reached 1.25 kN/m, which was higher than that in the optimal H 2 SO 4 -MnO 2 colloid. The surface chemistry results indicated that -COOH and -OH groups formed with the photocatalytic treatment and the absorption strengths increased with the UV power. XPS analysis results further demonstrated that the contents of C=O and -COOH reached 6.4 and 4.9% with the photocatalytic treatment, which was much higher than that of the H 2 SO 4 -MnO 2 colloid (3.9 and 3.1%). The high contents of C=O and -COOH groups enhanced the surface hydrophilicity of the ABS resin and improved the adhesion strength between the electroless copper film and ABS resin. The results indicated that the photocatalytic treatment was an environment-friendly and effective method to replace the commercial wet chemical process for ABS surface modification.

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Effect of triethanolamine on deposition rate of electroless copper plating

Cited by 24 publications

References 13 publications

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

Effect of additives on electroless silver plating

Surface modification of ABS by photocatalytic treatment for electroless copper plating

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Effect of triethanolamine on deposition rate of electroless copper plating

Cited by 24 publications

References 13 publications

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO2–H3PO4–H2SO4 Colloid

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO2–H3PO4–H2SO4 Colloid

Effect of additives on electroless silver plating

Surface modification of ABS by photocatalytic treatment for electroless copper plating

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Product

Resources

About

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid