Effects of Grain Orientation on Cu6Sn5 Growth Behavior 
in Cu6Sn5-Reinforced Composite Solder Joints During Electromigration

Han, Jing; Wang, Yan; Tan, Shihai; Guo, Fu

doi:10.1007/s11664-017-5898-6

Cited by 8 publications

(3 citation statements)

References 22 publications

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“…The T-E coupling test was carried out in an environmental test chamber. The current was set at 5 A, and the voltage at 1.385 V. The average current density at the polished joint interfaces was calculated as 3.4 kA/cm 2 , which is lower than that used in some earlier studies, 10,15,16,18 because the test in this study was carried out in air rather than in a thermostatic liquid, and a higher current density may melt the solder. 17 For the thermal cycling, two temperature ranges, i.e., −20°C to 80°C and −30°C to 60°C, were used.…”

Section: Methodsmentioning

confidence: 88%

“…Moreover, there is a sliding region at the upper solder/Cu surface, and the content of Cu 6 Sn 5 in this region is far lower, which corresponds to the low electromigration rate in this region. 16,18 The morphology of the No. 8 solder joint in Fig.…”

Section: T-e Coupling Damage At a Relatively Low Temperature Rangementioning

confidence: 99%

“…This is likely because the solder grain orientation in this solder joint is not conducive to Cu electromigration, and thus only a small amount of Cu migrates into the solder because the electromigration of Cu is almost suppressed when the current direction is nearly perpendicular to the [001] crystal direction. 16,18 Figure 8 shows the morphology of the No. 5 solder joint in Fig.…”

Section: T-e Coupling Damage At a Relatively High Temperature Rangementioning

confidence: 99%

See 2 more Smart Citations

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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In this study, in situ investigation of the coupling damage mechanisms of SnAgCu/Cu solder joints under thermal cycling and current was carried out to compare the thermal fatigue under the same temperature range, and to analyze the influence of temperature. It was found that the current increased the temperature of the solder joint, making it obviously higher than the ambient temperature. On the other hand, there was little difference between the thermal-electrical coupling damage and thermal fatigue before a significant increase in solder temperature; the interfacial plastic deformation was only slightly more serious, and the electromigration was not significant. With an increasing number of thermal cycles, the damage, resistance, and temperature of the solder joint increased, and the plastic deformation resistance of the solder decreased, leading to further damage and temperature increase, exhibiting an accelerating damage process. After the temperature reached a certain degree, the solder softened significantly, and its deformation behavior was similar to that of high-viscosity fluids, resulting in surface unevenness with significant height differences. As the temperature of the solder joint increased, the electromigration of Cu in the solder gradually increased, and the migration rate was dominated by the solder grain orientation. With higher peak temperature of the ambient thermal cycle, the thermal cycling-electric current coupling damage rate increased substantially.

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Section: Methodsmentioning

confidence: 88%

Section: T-e Coupling Damage At a Relatively Low Temperature Rangementioning

confidence: 99%

Section: T-e Coupling Damage At a Relatively High Temperature Rangementioning

confidence: 99%

See 1 more Smart Citation

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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IMC growth behavior along c-axis of Sn grain under current stressing

Wang

et al. 2018

J Mater Sci: Mater Electron

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Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects

Morozov

Freidin

Klinkov

et al. 2020

Journal of Elec Materi

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In this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong implication on solder joint reliability. Experiments show that the intermetallic layers grow considerably when the structure is exposed to heat. Mechanical stresses may also affect intermetallic growth behavior. These stresses arise not only from external loadings but also from thermal mismatch of the materials constituting the joint, and from the mismatch produced by the change in shape and volume due to the chemical reactions of IMC formation. This explains why in this paper special attention is being paid to the influence of stresses on the kinetics of the IMC growth. We develop an approach that couples mechanics with the chemical reactions leading to the formation of IMC, based on the thermodynamically sound concept of the chemical affinity tensor, which was recently used in general statements and solutions of mechanochemistry problems. We start with a report of experimental findings regarding the IMC growth at the interface between copper pads and tin based solder alloys in different microchips during a high temperature storage test. Then we analyze the growth kinetics by means of a continuum model. By combining experiment, theory, and a comparison of experimental data and theoretical predictions we finally find the values of the diffusion coefficient and an estimate for the chemical reaction constant. A comparison with literature data is also performed.

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Effects of Grain Orientation on Cu6Sn5 Growth Behavior in Cu6Sn5-Reinforced Composite Solder Joints During Electromigration

Cited by 8 publications

References 22 publications

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

IMC growth behavior along c-axis of Sn grain under current stressing

Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects

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