2010
DOI: 10.1109/ted.2010.2071130
|View full text |Cite
|
Sign up to set email alerts
|

Effects of Short-Term DC-Bias-Induced Stress on n-GaN/AlGaN/GaN MOSHEMTs With Liquid-Phase-Deposited $\hbox{Al}_{2}\hbox{O}_{3}$ as a Gate Dielectric

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
10
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
6
2
1

Relationship

0
9

Authors

Journals

citations
Cited by 20 publications
(10 citation statements)
references
References 29 publications
0
10
0
Order By: Relevance
“…Although introducing a gate dielectric in an AlGaN/ GaN High Electron Mobility Transistor (HEMT) can effectively reduce the gate leakage and increase the I on /I off ratio, [1][2][3][4][5][6][7][8] some of the problems in conventional HEMTs may still be lingering in the resulting Metal-Oxide-Semiconductor High-Electron-Mobility Transistors (MOS-HEMTs). One example is the so called "current collapse" phenomenon, decreases in drain current (I d ) and transconductance (G m ) under pulsed or high frequency conditions, which can be efficiently suppressed for HEMT devices as long as their access regions are properly passivated.…”
Section: And T P Mamentioning
confidence: 99%
“…Although introducing a gate dielectric in an AlGaN/ GaN High Electron Mobility Transistor (HEMT) can effectively reduce the gate leakage and increase the I on /I off ratio, [1][2][3][4][5][6][7][8] some of the problems in conventional HEMTs may still be lingering in the resulting Metal-Oxide-Semiconductor High-Electron-Mobility Transistors (MOS-HEMTs). One example is the so called "current collapse" phenomenon, decreases in drain current (I d ) and transconductance (G m ) under pulsed or high frequency conditions, which can be efficiently suppressed for HEMT devices as long as their access regions are properly passivated.…”
Section: And T P Mamentioning
confidence: 99%
“…Because of its low leakage current, wide bandgap and relatively low value of dielectric constant, Al 2 O 3 (alumina) is considered to be an appropriate insulator for several electronic and electro-optical applications. Al 2 O 3 have been employed in several devices ranging from gate dielectric in metal-oxide-semiconductor transistors to trapping or blocking insulator in charge trapping nonvolatile memory cells and scaffold layer in perovskite solar cells [1][2][3][4][5][6]. It is well known that different metastable polymorphs of Al 2 O 3 exist (like α, γ, η, δ, θ, χ and amorphous phases) in addition to the thermodynamically stable α-Al 2 O 3 form [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…In order to overcome this problem MOSHEMT technology came into picture which includes an oxide layer between gate and AlGaN barrier layer. The oxide layer may be SiO 2 [3], Al 2 O 3 [4], TiO 2 [5] or HfO 2 [6].…”
Section: Introductionmentioning
confidence: 99%