Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

Huang, Huizhen; Gewang, Shuai; Wei, Xiuqin; Yin, Chuanqiang

doi:10.1016/j.microrel.2017.05.010

Cited by 25 publications

(10 citation statements)

References 26 publications

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“…It is a practical and effective method to study the influence of element doping on the wettability of solder under laboratory conditions. Huang et al [113] researched the effect of S element on the wettability of Sn-0.7Cu solder on Cu substrate in 3.5% NaCl solution. Figure 17 shows that the wetting performance of Sn-0.7Cu solder can be greatly improved by adding 0.08% S. S is easy to concentrate on the surface of the solder melt during the soldering process, which reduces the surface tension of the alloy since the non-metallic element S is difficult to dissolve into the alloy.…”

Section: Wettabilitymentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/ solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

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Section: Wettabilitymentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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“…Thermodynamically, Sn oxide was readily formed, making Sn hydroxide dehydrate to form Sn oxide. 24–27 The specific reaction process was as follows:Sn + 2OH − = Sn(OH) 2 + 2e − Sn(OH) 2 = SnO + H 2 OSn(OH) 2 + 2OH − = Sn(OH) 4 + 2e − Sn(OH) 4 = SnO 2 + 2H 2 O…”

Section: Resultsmentioning

confidence: 99%

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Shenggang,

Yi,

Jihao

et al. 2023

RSC Adv.

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“…S is known as an active nonmetallic element. It was found that trace amounts of S can improve the wettability and oxidation resistance of Sn-based lead-free alloys [27,28]. Little information about its effects on the corrosion behaviour of Sn-Zn alloys in erosion solution has been reported.…”

Section: Introductionmentioning

confidence: 99%

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

Huang

Zhang

et al. 2023

Materials Science and Technology

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The effects of S addition on the corrosion behaviour of Sn-9Zn solders in 3.5 wt-% NaCl solution were investigated using dynamic potential polarisation, electrochemical impedance spectroscopy techniques and weight loss measurement. The results indicate that S addition could obviously improve the corrosion resistance of Sn-9Zn solder alloy as revealed by much lower corrosion current density, higher impedance and the reduced weight loss. It is believed that the homogeneous microstructures of Sn-9Zn, especially the black refined Zn-rich phases are favourable to improve its corrosion resistance. SEM observations found that S addition might promote the formation of denser and more uniform corrosion products on the solder surface. The main corrosion product was Zn5(OH)8Cl2·H2O determined by EDS and XRD analysis.

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Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

Cited by 25 publications

References 26 publications

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

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