2009
DOI: 10.1016/j.apsusc.2008.11.011
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Electric and ferroelectric properties of PZT/BLT multilayer films prepared by photochemical metal-organic deposition

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Cited by 12 publications
(4 citation statements)
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“…[ 59,61 ] In PMOD based fabrication, dry or wet etching is not necessary, which as a result avoids introducing physical defects, chemical degradation of the patterned materials, and pollution from hazardous by‐products during dry or wet etching. [ 52 ] Moreover, the PMOD process can be performed under ambient conditions (e.g., room temperature, atmospheric pressure), which limits the inter‐diffusion of materials between the encapsulating matrix (e.g., TiO x ) and the nanoparticles (e.g., UCNPs) and otherwise avoids damage to the patterns and the nanoparticles. [ 62 ]…”
Section: Resultsmentioning
confidence: 99%
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“…[ 59,61 ] In PMOD based fabrication, dry or wet etching is not necessary, which as a result avoids introducing physical defects, chemical degradation of the patterned materials, and pollution from hazardous by‐products during dry or wet etching. [ 52 ] Moreover, the PMOD process can be performed under ambient conditions (e.g., room temperature, atmospheric pressure), which limits the inter‐diffusion of materials between the encapsulating matrix (e.g., TiO x ) and the nanoparticles (e.g., UCNPs) and otherwise avoids damage to the patterns and the nanoparticles. [ 62 ]…”
Section: Resultsmentioning
confidence: 99%
“…This approach avoids physical defects, chemical degradation of the films, and pollution associated with hazardous by‐products resulting from dry or wet etchants. [ 52 ] The PMOD based approach also enables good control over the atomic ratio of metallic species in these thin films. This control can be used to create multi‐component compositions (e.g., Pb(ZrTi)O 3 ).…”
Section: Introductionmentioning
confidence: 99%
“…Kao et al reported that the films showed improvement of electrical properties using the sol-gel method [2]. The excellent fatigue property up to 1010 cycles by the metal organic deposition (MOD) method was reported [3,4]. A.Z.…”
Section: Introductionmentioning
confidence: 99%
“…60, 20, and 30 μC/cm 2 , respectively. [12][13][14][15][16][17][18][19][20] However, relatively high processing temperatures are necessary to form the crystalline ferroelectric films, i.e., > 650 • C, >750 • C, and >650 • C for PZT, SBT, and BIT, respectively. Such high temperatures can damage logic circuits monolithically integrated with FRAMs and may oxidize transistor electrodes; for example, nickel silicide can only tolerate 450 to 490 • C. 18 Inevitably, the ferroelectric layer should be fabricated prior to transistor formation, which complicates procedures.…”
mentioning
confidence: 99%