Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Chan, Y. C.; Tan, S.C.; Lui, N.S.M.; Tan, C.W.

doi:10.1109/tadvp.2006.884814

Cited by 15 publications

(6 citation statements)

References 3 publications

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“…7a). The test patterns were modified from [23, 27, 28] in order to be used with MMFI. The test substrate was fabricated by depositing 1 µm thick aluminum on a silicon wafer with 1.2 µm Si 3 N 4 deposited using PECVD.…”

Section: Reliability Testing Of Mmfimentioning

confidence: 99%

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Jackson

Muthuswamy

2009

J. Microelectromech. Syst.

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We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

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Section: Reliability Testing Of Mmfimentioning

confidence: 99%

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Jackson

Muthuswamy

2009

J. Microelectromech. Syst.

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“…As such, plastic deformation of the bumps should be sufficient so that the shortest bump can be in contact with the pad of the substrate. Compared to Au and Au/Ni bumps used previously [5,16], Sn bumps and Sn-Ag bumps used in this study were easily deformed since these materials are very soft. Sn-based bumps can very effectively compensate for the variation in bump height.…”

Section: Discussionmentioning

confidence: 83%

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Harr

Kim

et al. 2015

Microelectronics Reliability

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“…It has been widely used in displays and mobile handset devices [1][2][3][4][5][6][7][8][9][10][11], mainly in chip-on-flex (COF), chip-on-glass (COG), chip-on-board (COB) and chip-onplastic (COP). Recently, this type of adhesive have been applied to Si chip stacking and shown an acceptable reliability performance [12][13].…”

Section: Introductionmentioning

confidence: 99%

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Lin

Zhan

Kao

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Cited by 15 publications

References 3 publications

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

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Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Cited by 15 publications

References 3 publications

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30&#x03BC;m-pitch micro solder bump interconnections

Contact Info

Product

Resources

About

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections