Electrochemical composite deposition of Sn–Ag–Cu alloys

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

“…The hardness of solder joints containing TiO 2 nano-particles displayed consistently higher values than that of plain solder joints due to the homogeneous distribution of TiO 2 nanoparticles and refinement of the IMC particles i.e. Ag 3 Sn, Cu 5 Sn 6 and AuSn 4 which can act as reinforcement. According to the dispersion strengthening mechanism, the fine IMC particles and TiO 2 nano-particles can improve the mechanical properties of a solder joint.…”

“…BGA joints provide both the mechanical strength and electrical conductivity, which play a significant role in the connection between electronic component and printed circuit boards [4]. Recently, many Sn-based lead-free solders have been studied such as Sn-Ag, Sn-Cu, Sn-Au, Sn-Ag-Cu and Sn-Zn as replacements for the traditional Sn-Pb solder [5][6][7]. Among the numerous substitutes for Sn-Pb solders, Sn-Ag-Cu lead-free solder has been regarded as a promising candidate to replace the conventional Sn-Pb solder due to its modest melting temperature, reasonable solderability, comparable electrical performance and good mechanical properties [8,9].…”

Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux

“…Up to date, tin/silver/copper (Sn/ Ag/Cu) probably is the most widely used lead-free solder material. The Sn/Ag/Cu (SAC) system has a melting point around 217°C or higher, depending on its respective compositions, and is mainly used in surface-mount technology (SMT) [7,8]. Due to the wellknown melting temperature depression phenomenon of nanoparticles [9,10] and the potential to be used in the smaller feature sized assembly and packaging, nanosolders started to attract more and more attention.…”

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

“…Up to now, several types of binary and ternary Sn-based lead-free solders such as Sn-Ag, Sn-Cu, Sn-Au, Sn-Ag-Cu and Sn-Zn have been developed and applied in the electronic packaging industry [4][5][6]. Among the various types of lead-free solders, with a combination of process attributes like a modest melting temperature and reasonable solderability, comparable electrical performance and good mechanical properties, Sn-Ag-Cu solder has been proposed as one of the most promising substitutes for conventional Sn-Pb solder [7,8]. Moreover, with the advancement of micro-/nanosystems technology through the years, microelectronic components have evolved to become smaller, lighter and more functional.…”