Electroless plating of copper at a low pH level

Jagannathan, R.; Krishnan, M.

doi:10.1147/rd.372.0117

Cited by 46 publications

(48 citation statements)

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“…The recipe of copper plating in Table 1 was prepared by reference to Jagannathan. [54,55] All of the reagents, which were dissolved in deionized water at room temperature, were stirred for several minutes. To keep the solution stable, a bubble generator with air was used in the plating bath.…”

Section: Electroless Copper Plating Stepmentioning

confidence: 99%

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng¹,

Mo-hua²,

Chiu³

et al. 2005

Macromol. Rapid Commun.

173

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Summary: The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low‐cost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a flexible substrate by combining self‐assembled polyelectrolytes, ink‐jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration‐induced assistance during an ink‐jet printing catalyst process, line width and blurring can be controlled to within ±3% variation. Following the IPC 6013 standard for flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via‐hole inner wall on a flexible substrate. This novel fabrication method is ideal for the realization of large area, flexible electronics and future multilayer flexible substrate application, such as flexible display, chip on flexible substrate, etc., particularly where traditional lithographic processes can not be applied.Flexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).magnified imageFlexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).

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Section: Electroless Copper Plating Stepmentioning

confidence: 99%

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng¹,

Mo-hua²,

Chiu³

et al. 2005

Macromol. Rapid Commun.

173

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“…It is a volatile, flammable and possibly carcinogen liquid. Hence researches are developing towards alternative reducing agents such as borohydride [14], amine borane [15], glyoxylic alcohol or glyoxylate [4,16]; or, most commonly, sodium hypophosphite [17][18][19][20][21][22], which is widely used as reducing agent for electroless nickel deposition [13,23]. However, the main difficulty results from the fact that the oxidation of hypophosphite is not catalyzed by copper [12,[16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Electroless deposition of copper in acidic solutions using hypophosphite reducing agent

Touir¹,

Larhzil²,

EbnTouhami³

et al. 2005

J Appl Electrochem

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A new bath formulation was developed, which allowed deposition of copper-rich Cu-Ni-P alloys in electroless acidic solutions in the absence of formaldehyde. The reducing agent was sodium hypophosphite. Though cupric ions do not catalyse the oxidation of hypophosphite, we show that, in the presence of a low concentration of Ni(II) species, it is possible, even at low pHs, to induce the reduction of the cupric species. A very strong preferential deposition of copper was observed, which gives Cu-Ni-P layers with copper content up to 97 wt%. The phosphorus content decreased from 13% to 1% with increasing copper content. The plating rate decreased when the copper sulfate concentration in the solution increased. It increased with increasing pH or temperature, but the influence was less pronounced than in alkaline solutions. Compact layers were obtained with a nodular morphology which did not markedly changed with composition.

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“…Polyhydroxylic compounds have therefore gained importance as chelants in electroless plating because they are easily bio-degradable [9][10][11][12] similarly, the more ecofriendly methanesulphonic acid (MSA) is being increasingly used in electroless copper plating instead of conventionally used fluoroboric acid. Additions of small amounts of MSA have been reported to produce uniform and high quality coatings [13][14][15][16][17][18]. In this work, we report the use of pyridine and 2,2-dipyridyl as primary stabilizers in electroless copper methanesulphonate, saccharose and xylitol baths.…”

Section: Iintroductionmentioning

confidence: 99%

Influence of Green Polyhydroxylic Compounds on Copper Nano Thin Film Deposition

Ramesh¹,

Venkatesh²,

Jayalakshmi³

2017

ijarmps

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In this work, we utilized the regular polyhydroxylic complexing agents' saccharose and xylitol to develop an eco-friendly electroless deposition process for copper. The electroless bath used formaldehyde free glyoxylic acid as reducing agent and KOH as the pH adjustor, rather than NaOH, to avoid the development of insoluble by-product. A small volume of the green Bronsted acid, methanesulphonic acid (MSA) was also used in the bath to improve solubility of the copper salts. The surface morphologies and structural property of copper deposits were characterized by SEM, AFM and XRD studies. Pyridine and 2,2-dipyridyl as primary stabilizers in saccharose and xylitol baths were found to influence the deposition rate and thickness of the copper deposits. In the saccharose bath, Pyridine performed as inhibitors and best deposition was obtained at pH of 12.75. 2,2-dipyridyl afforded smoother and shiner deposits than Pyridine. In xylitol bath, both the stabilizers were best deposition occurred at a pH of 13.25 and served as the accelerator and extended the life of the electroless bath.

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Electroless plating of copper at a low pH level

Cited by 46 publications

References 0 publications

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Electroless deposition of copper in acidic solutions using hypophosphite reducing agent

Influence of Green Polyhydroxylic Compounds on Copper Nano Thin Film Deposition

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