Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

“…Concerning the chemical surface modification, three types of surface modification techniques have been used to increase the adhesion toward electroless copper on a variety of polymer substrates: wet-chemical [10][11][12], plasma [13][14][15][16], plasma induced graft (co)polymerization [17,18]. Out of these results it became clear that the introduction of (quaternary) amine groups on the polymer surface reveal the largest potential to increase the copper adhesion.…”

Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive

“…Recently, several methods have been reported to achieve strong adhesive force between copper film and polyimide with micrometer line and scale without creating micrometer-scale surface roughness. For example, Neoh et al [8][9][10][11][12][13][14] and Inagaki et al [15][16][17][18][19] modified polyimide by graft polymerization of vinylimidazole or vinylpyridine. The plated copper layer interacts with the nitrogen group of the graft polymer, which creates a strong adhesive force between the PI and the copper layer.…”

Surface modification of polyethylene film by acrylamide graft and alcoholysis for improvement of antithrombogenicity

“…Especially, UV-induced graft polymerization is common, which usually need photo-initiator. However, Neoh and co-workers reported that cohesiveness of polymers was increased through combining plasma pretreatment with UV-induced graft polymerization without a photo-initiator [14][15][16][17]. In this paper, a new method to reduce non-specific adsorption of protein and enhance selective absorption of albumin is reported.…”