High-NMOSFET structures designed for enhancement mode operation have been fabricated with mobilities exceeding 6000 cm 2 Vs. The NMOSFET structures which have been grown by molecular beam epitaxy on 3-in semi-insulating GaAs substrate comprise a 10 nm strained InGaAs channel layer and a high-dielectric layer ( = 20). Electron mobilities of 6000 and 3822 cm 2 Vs have been measured for sheet carrier concentrations of 2-3 10 12 and = 5 85 10 12 cm 2 , respectively. Sheet resistivities as low as 280 sq have been obtained.