Emerging ADAS Thermal Reliability Needs and Solutions

Chang, Norman; Pan, Stephen H.; Srinivasan, Karthik K.; Feng, Zhigang; Xia, Weiyi; Pawlak, Tim; Geb, David

doi:10.1109/mm.2018.112130058

Cited by 9 publications

(3 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…State-of-the-art DMAS shall combine the features and capabilities built on advanced and diverse technologies. To the best of the authors’ understanding, the future of DMAS lies in the following key trends [244,245,246,247,248]: Connectivity: Communication networks are becoming an integral part of both external and in-vehicle connectivity as vehicle-related digital-data grows substantially. In addition to their assistance in crucial systems such as braking systems and tire-pressure monitoring, wireless networks provide superior flexibility for regular automotive communications protocols.…”

Section: Dmas In Modern Vehiclesmentioning

confidence: 99%

A Comprehensive Survey of Driving Monitoring and Assistance Systems

Khan

Lee

2019

Sensors

163

View full text Add to dashboard Cite

Improving a vehicle driver’s performance decreases the damage caused by, and chances of, road accidents. In recent decades, engineers and researchers have proposed several strategies to model and improve driving monitoring and assistance systems (DMAS). This work presents a comprehensive survey of the literature related to driving processes, the main reasons for road accidents, the methods of their early detection, and state-of-the-art strategies developed to assist drivers for a safe and comfortable driving experience. The studies focused on the three main elements of the driving process, viz. driver, vehicle, and driving environment are analytically reviewed in this work, and a comprehensive framework of DMAS, major research areas, and their interaction is explored. A well-designed DMAS improves the driving experience by continuously monitoring the critical parameters associated with the driver, vehicle, and surroundings by acquiring and processing the data obtained from multiple sensors. A discussion on the challenges associated with the current and future DMAS and their potential solutions is also presented.

show abstract

Section: Dmas In Modern Vehiclesmentioning

confidence: 99%

A Comprehensive Survey of Driving Monitoring and Assistance Systems

Khan

Lee

2019

Sensors

163

View full text Add to dashboard Cite

show abstract

“…The authors of [22] presented a methodology of predicting electronic devices reliability, which is based on the so-called PoF (physics of failure) model, incorporating the influence of die temperature on thermomechanical behavior of semiconductor device. Analysis of temperature effect on expected lifetime duration of contemporary ADAS electronic devices and systems is described in [4]. The same paper provides an insight into a methodology allowing for diagnosis of this sort of problems in the early stage design phase.…”

Section: The Need For Cooling Of Electronic Devicesmentioning

confidence: 99%

The concept of integrating vapor chamber into a housing of electronic devices for increased thermal reliability

Korta¹,

Skruch²

2020

Eksploatacja i Niezawodność – Maintenance and Reliability

View full text Add to dashboard Cite

show abstract

“…Especially as automobiles have become more and more electric recently, it is inevitable that many functional electronic devices, such as ADAS sensors, computing devices, and connectivity devices, are going to be applied to automobiles [4,5]. These new kinds of electronic devices for the automotive industry require semiconductor packaging technology that exhibits high reliability and high thermal performance so that the electronics can operate under harsh conditions and realize high power density and efficiency [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Two-Layer Rt-QFN: A New Coreless Substrate Based on Lead Frame Technology

Kim¹,

Ryu²,

Kang³

et al. 2022

Coatings

View full text Add to dashboard Cite

Lead frames have been widely used in the semiconductor package assembly industry; a lot of demand is still maintained in fields requiring high reliability, such as automobiles, although many fields are being replaced by laminated substrates according to the recent electronic package product trend that requires high I/O pin count. The purpose of this paper is to introduce two-layer Rt-QFN, one of the lead frame-based coreless substrates. (Rt-QFN is a trademark of Haesung DS, which means premold type lead frame substrate.) two-layer Rt-QFN can secure more advanced design freedom compared with the lead frame and thus has I/O pin count coverage intermediate between the lead frame and laminated substrate. In addition, Rt-QFN can exhibit excellent heat dissipation performance by replacing via holes of the laminated substrate with Cu bumps formed by etching. CAE analysis showed that the thermal resistance of the two-layer Rt-QFN substrate was about 23% lower than that of the laminate substrate. The excellent heat dissipation property of two-layer Rt-QFN allows it to replace the existing expensive ceramic substrate and can achieve cost savings. In addition, the sputtering technique, including the LIS (Linear Ion Source) module, was introduced as a method to sufficiently secure the interfacial adhesion between the resin/Cu interface, which is a key factor in producing a two-layer substrate. As a method to enhance the interfacial adhesion between the resin/Cu interface, the collimated mode of LIS was used in the Ar atmosphere inside the vacuum chamber to activate the resin surface. After plasma pretreatment on the surface of the resin, a Cu seed layer was continuously formed by sputtering. As a result, it was possible to secure the high reliability of the two-layer Rt-QFN substrate, and it was confirmed through the evaluation of interfacial adhesion of more than 1.2 kgƒ/cm during the peel-off tape test at the resin/Cu interface and further moisture absorption evaluation.

show abstract

Emerging ADAS Thermal Reliability Needs and Solutions

Cited by 9 publications

References 7 publications

A Comprehensive Survey of Driving Monitoring and Assistance Systems

A Comprehensive Survey of Driving Monitoring and Assistance Systems

The concept of integrating vapor chamber into a housing of electronic devices for increased thermal reliability

Two-Layer Rt-QFN: A New Coreless Substrate Based on Lead Frame Technology

Contact Info

Product

Resources

About