“…Among many emerging memory technologies like resistive random access memory (ReRAM) − and phase change memory (PCM), − ferroelectric field effect transistors (FeFETs) seem to be the most promising ones. The pronunciation of ferroelectricity in a single-layer thin film of hafnium oxide (HfO 2 ), fast switching, high on-current ( I ON ) to off-current ( I OFF ) ratio ( I O N I O F F ) , excellent linearity in synaptic weight updates, bidirectional operation, and good endurance are the key technological factors that make FeFET superior to other methods. ,− ,, However, the primary bottleneck in implementing the FeFET-based computing system lies in the intrinsic stochasticity owing to the polycrystalline nature of HfO 2 -based ferroelectric thin film, as well as inherent defect sites that may capture electrons or holes from the channel side (CS) or gate side (GS). − Numerous efforts have been made to reduce the impacts of such nonidealities from the device process, and a circuit point of view. − ,, Previously, it has been reported how the quality of the interface and the READ -Voltage play a pivotal role in the performance of FeFETs, especially for low-frequency noise response, retention, and endurance. ,,,,− In this work, we aim to maximize the reliability and performance of FeFETs by adopting a synergistic approach of READ -voltage optimization and interfacial-layer engineering.…”