Metal-oxide-semiconductor capacitors with Sm 2 O 3 dielectric film were fabricated and the temperature dependence of the conduction mechanisms was studied. The Sm 2 O 3 films were deposited by radio frequency magnetron sputtering. The thickness of Sm 2 O 3 was 18.8 nm. The dielectric permittivity and the equivalent oxide thickness of capacitors with Sm 2 O 3 film were 15.0 and 4.8 nm, respectively. The X-ray photoelectron spectroscopy analysis showed a silicate interfacial layer formed between Sm 2 O 3 and Si. When the aluminum electrode was biased positive, the dominant conduction mechanism was Schottky emission in the temperature range 475 K Ͻ T Ͻ 500 K and at an electrical field of 0.8 MV/cm Ͻ E Ͻ 1.4 MV/cm. In the temperature range 300-425 K, the dominant conduction mechanism was most likely space-charge-limited conduction. When the aluminum electrode was biased negative, the dominant conduction mechanism in the temperature range from 325 to 500 K and at an electrical field from 0.08 to 0.81 MV/cm was Schottky emission. At 77 K and with the electrical field above 0.9 MV/cm, the conduction mechanism was Fowler-Nordheim ͑F-N͒ tunneling. The Al/Sm 2 O 3 electron barrier height and the effective electronic mass calculated from Schottky emission and F-N tunneling were 0.82 eV and 0.13 m 0 , respectively.Recently, many candidates such as tantalum oxide ͑Ta 2 O 5 ͒, 1 titanium dioxide ͑TiO 2 ͒, 2 aluminum oxide ͑Al 2 O 3 ͒, 3 zirconium ͑ZrO 2 ͒, 4-6 hafnium oxide ͑HfO 2 ͒, 4-8 dysprosium oxide ͑Dy 2 O 3 ͒, 9-12 and samarium oxide ͑Sm 2 O 3 ͒ have been introduced as alternative gate dielectrics. Among these high-k oxides, Sm 2 O 3 is a potential candidate to achieve high dielectric constant ͑12-13͒, large energy bandgap ͑4.33 eV͒, high thermal stability, and low leakage current density. [13][14][15][16] In the literature, Dakhel 17 observed Schottky emission at the Al/Sm 2 O 3 interface in Al/Sm 2 O 3 /Al devices and extracted a Schottky barrier of s = 0.85 eV. Rozhkov et al. 18 reported that the energy barriers at the Al/Sm 2 O 3 and the Si/Sm 2 O 3 interfaces extracted from internal photoemission of carriers were 2.89-2.91 and 2.70-2.72 eV, respectively. Yang and Xue 19 showed that the leakage current density of Sm 2 O 3 was 10 −4 A/cm 2 for an electric field of 0.24 MV/cm. However, there are relatively few reports on the temperature dependence of the conduction mechanisms with Sm 2 O 3 dielectric. In this work, the material properties were investigated by X-ray photoelectron spectroscopy ͑XPS͒ and transmission electron microscopy ͑TEM͒. The conduction mechanisms such as Schottky emission, Fowler-Nordheim ͑F-N͒ tunneling, and space-chargelimited conduction ͑SCLC͒ were also studied.Experimental p-Type, ͑100͒ orientation, 4 in. diameter silicon wafers with 5-10 ⍀ cm resistivity were used as the starting substrates. Following wafer cleaning, the Sm 2 O 3 films were deposited at room temperature by radio frequency magnetron sputtering in argon ͑Ar͒. The pressure of Ar gas during deposition was 5 ϫ 10 −3 Torr. The thic...