2021
DOI: 10.1002/app.51497
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Enhanced thermal conductivity and wear resistance of polytetrafluoroethylene via incorporating hexagonal boron nitride and alumina particles

Abstract: Polytetrafluoroethylene (PTFE) receives wide attention in electronic packaging materials due to its excellent dielectric properties, friction properties and thermal stability. However, its extremely low thermal conductivity limits its further application. In this work, hexagonal boron nitride (h-BN) platelets are added into PTFE matrix to improve the thermal conductivity as the expense of largely deteriorated friction property. To make up the loss of friction property, alumina particles (AO) are also added and… Show more

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Cited by 21 publications
(19 citation statements)
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“…The inorganic filler material is useful for improving the mechanical, thermal, and tribological properties of the polymers. An ample amount of work has been reported on the usage of conventional inorganic fillers 2–4 . Chen et al 2 used inorganics ceramic fillers hexagonal boron nitride and aluminum oxide for the development of a polytetrafluoroethylene hybrid composite.…”
Section: Introductionmentioning
confidence: 99%
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“…The inorganic filler material is useful for improving the mechanical, thermal, and tribological properties of the polymers. An ample amount of work has been reported on the usage of conventional inorganic fillers 2–4 . Chen et al 2 used inorganics ceramic fillers hexagonal boron nitride and aluminum oxide for the development of a polytetrafluoroethylene hybrid composite.…”
Section: Introductionmentioning
confidence: 99%
“…An ample amount of work has been reported on the usage of conventional inorganic fillers. [2][3][4] Chen et al 2 used inorganics ceramic fillers hexagonal boron nitride and aluminum oxide for the development of a polytetrafluoroethylene hybrid composite. They found improvement in the thermal conductivity of composite by the addition of hexagonal boron nitride and enhancement in tribological properties in the composites by the addition of aluminum oxide.…”
mentioning
confidence: 99%
“…It can used to achieve better thermal conductivity and to control the dielectric performance of polymer system. 26 On the other hand, limited reports are available on h-BN dispersed polymer blends and composites for ESD applications. To improve the electrostatic performance of h-BN, intrinsic properties should be altered by functionalizing it such as polar, electron or optical scattering.…”
Section: Introductionmentioning
confidence: 99%
“…Hexagonal boron nitride commonly known as white graphene due to its structural arrangement similar to graphene. It can used to achieve better thermal conductivity and to control the dielectric performance of polymer system 26 . On the other hand, limited reports are available on h‐BN dispersed polymer blends and composites for ESD applications.…”
Section: Introductionmentioning
confidence: 99%
“…And due to the low dielectric properties of PTFE, the dielectric constant and loss tangent of 30 vol % hybrid composites are 3.23 and 0.012 at 1 MHz, respectively. Chen et al 32 chose alumina particles (AO) to overcome the anisotropy in thermal conductivity. The through-plane thermal conductivity of PTFE/HBN/AO composite filled with 30 vol % hybrid fillers can be increased to 1.544 W/(m•K) (5.5 times that of PTFE).…”
Section: ■ Introductionmentioning
confidence: 99%