Confi nement and manipulation of photons using microcavities have triggered intense research interest for more than a decade. [ 1 ] Prominent examples are whispering gallery mode (WGM) microcavities, [ 2 , 3 ] which confi ne photons by means of continuous total internal refl ection along a curved and smooth surface. The long photon lifetime (described by high Q factors), strong fi eld confi nement, and in-plane emission characteristics make them promising candidates for novel light sources [4][5][6][7][8][9] and biochemical sensors with the ability of detecting few or even single nanoparticles. [ 10 , 11 ] The principal disadvantage of circular WGM microcavities is their intrinsic isotropy of emission due to their rotational symmetry. In addition to the photonic structures consisting of two or more perfectly spherical microcavities, [ 12 ] one of vital solutions is to use deformed microcavities by breaking the rotational symmetry, [13][14][15][16] which can provide not only the directional emission but also the effi cient and robust excitation of WGMs by a free-space optical beam. [17][18][19][20] Deformed microcavities fabricated on a chip are particularly desired for high-density optoelectronic integration, but they suffer from low Q factors in experiments. The Q factors are typically around or even smaller than ten thousand [21][22][23][24][25][26][27] limited by the large scattering losses from the involuntary surface roughness. The high Q factor is of great importance in fundamental studies and on-chip photonic applications. Here, with a pattern transfer technique and a refl ow process ensuring a nearly atomic-scale microcavity surface, we demonstrate experimentally on-chip undoped silica deformed microcavities which support both nearly unidirectional emission and ultrahigh Q factors exceeding 100 million. Consequently, low-threshold, unidirectional microlasing in such a microcavity with Q factor about 3 million is realized by erbium doping and a convenient free-space excitation.The deformed microcavities are fabricated from a 2-μ mthick layer of silicon dioxide on a silicon wafer. Combining a two-step dry etching process and a laser refl ow process is employed for the fi rst time to transfer patterns and achieve microcavities with designed shapes and ultra-smooth cavity surface. The process details are depicted in Figure 1 a. First, we purposely design the mask patterns with minor modifications from the desired deformed toroidal boundaries R ( ϕ ) by adding an extra 15 μ m in the radius at all polar angles. Through optical lithography followed by buffered HF etching, deformed silica disks are created on the silicon wafer, which inherit the mask patterns well. Subsequently, the resulting silica disks are exposed to XeF 2 gas at 2.7 torr to etch the underneath silicon by about 15 μ m. In this process, the silica disks keep their original shapes and also serve as etching masks for the silicon underneath; consequently a silicon pillar is formed under each disk. Owing to the isotropic dry etching of silicon, ...