Evaluation of post-curing and laser manufacturing parameters on the properties of SOMOS 7110 photosensitive resin used in stereolithography

Salmoria, Gean Vitor; Ahrens, Carlos Henrique; Beal, Valter Estevão; Pires, Alfredo T. N.; Soldi, Valdir

doi:10.1016/j.matdes.2008.05.016

Cited by 72 publications

(57 citation statements)

References 13 publications

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“…There are several methods for analyzing the curing state of 3D-printed photopolymers, including differential scanning calorimetry (DSC), spectroscopic methods, and mechanical analysis [ 18 , 19 , 20 , 21 , 22 , 23 ]. While spectroscopic methods give direct chemical information about the double-bond conversion, there are several limitations for measuring printed parts.…”

Section: Introductionmentioning

confidence: 99%

Visible Light Photoinitiator for 3D-Printing of Tough Methacrylate Resins

et al. 2017

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Lithography-based additive manufacturing was introduced in the 1980s, and is still the method of choice for printing accurate plastic parts with high surface quality. Recent progress in this field has made tough photopolymer resins and cheap LED light engines available. This study presents the influence of photoinitiator selection and post-processing on the thermomechanical properties of various tough photopolymers. The influence of three photoinitiators (Ivocerin, BAPO, and TPO-L) on the double-bond conversion and mechanical properties was investigated by mid infrared spectroscopy, dynamic mechanical analysis and tensile tests. It was found that 1.18 wt % TPO-L would provide the best overall results in terms of double-bond conversion and mechanical properties. A correlation between double-bond conversion, yield strength, and glass transition temperature was found. Elongation at break remained high after post-curing at about 80–100%, and was not influenced by higher photoinitiator concentration. Finally, functional parts with 41 MPa tensile strength, 82% elongation at break, and 112 °C glass transition temperature were printed on a 405 nm DLP (digital light processing) printer.

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Section: Introductionmentioning

confidence: 99%

Visible Light Photoinitiator for 3D-Printing of Tough Methacrylate Resins

et al. 2017

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“…A common issue with AM technologies based on FPP such as SLA or MIP-SL is the uncontrolled penetration of light energy into the photocuring material [17,18]. Consequently, a non-desired material solidification is produced in down-facing surfaces.…”

Section: Introductionmentioning

confidence: 99%

Optimisation procedure for additive manufacturing processes based on mask image projection to improve Z accuracy and resolution

Bonada

Muguruza

Fernández‐Francos

et al. 2018

Journal of Manufacturing Processes

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Mask image projection is an additive manufacturing (AM) technique used in photocurable materials which allows the simultaneous energy delivery in a whole area instead of a single spot. A common problem for this AM process is the uncontrolled penetration of light energy, which could cause a solidification of non - desired layers. In this paper , an optimization procedure is developed and presented in order to increase Z accuracy and resolution of printed parts through the control of the total accumulated dose and the photocuring conversion ratio of each spatial location of the manufacturing volu me. Consequently, the uncontrolled monomer - to - polymer conversion of down - facing surfaces could be reduced. A finite element strategy is used in the optimisation procedure to obtain a full discretization of the whole manufacturing domain. Furthermore, exper imental tests have been done to compare experimental results and numerical estimations. The results show that the use of the optimisation procedure increases the accuracy and resolution of printed parts along the manufacturing direction.Peer ReviewedPostprint (author's final draft

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“…Therefore, the acrylate base resins have eliminated gradually in the market. In recent ten years [6][7][8] , there has been no shortage of efforts to develop novel resin systems that can be used for the SL process. It has now been found that the photosensitive resins of epoxy-acrylate hybrid systems can be used for SL process, and the photosensitive resins are distinguished by a very low viscosity, a very low shrinkage, a very low curl factor and good mechanical properties in the green state and after full curing.…”

Section: Introductionmentioning

confidence: 99%

Preparation of 3DPSL-1 Type Photosensitive Resin and Study on Its Properties

Huang¹,

Chen²,

Du³

2017

dtetr

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Abstract. 3DPSL-1(3D printing stereolithography No.1) type photosensitive resin was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (ERL-4221), bisphenol A type epoxy diacrylate (DH-306), tripropylene glycol diacrylate (TPGDA), Diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate(TDE-85), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30℃ was 355mP a .S, the glass transition temperature (Tg) of the UV-cured specimen was 52℃, and the weight loss of the UV-cured specimen at 200℃ was less than 4%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

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Evaluation of post-curing and laser manufacturing parameters on the properties of SOMOS 7110 photosensitive resin used in stereolithography

Cited by 72 publications

References 13 publications

Visible Light Photoinitiator for 3D-Printing of Tough Methacrylate Resins

Visible Light Photoinitiator for 3D-Printing of Tough Methacrylate Resins

Optimisation procedure for additive manufacturing processes based on mask image projection to improve Z accuracy and resolution

Preparation of 3DPSL-1 Type Photosensitive Resin and Study on Its Properties

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