2011
DOI: 10.1016/j.solmat.2011.03.001
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Experimental and analytical study of saturation current density of laser-doped phosphorus emitters for silicon solar cells

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Cited by 20 publications
(4 citation statements)
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“…The measured ranges of the resistance and sheet resistance are 100-450 Ω and 60-220 Ω/◻, respectively. A diffusion temperature of 1000-1150 ∘ C could grow a P-N junction with sheet resistance within the scope of the ideal P-N junction surface sheet resistance 60-200 Ω/◻ [28][29][30]. Samples with P-N junction growth enabled by diffusion temperatures of 1000-1150 ∘ C were used for further cell fabrication.…”
Section: Sheet Resistance Measurementsmentioning
confidence: 99%
“…The measured ranges of the resistance and sheet resistance are 100-450 Ω and 60-220 Ω/◻, respectively. A diffusion temperature of 1000-1150 ∘ C could grow a P-N junction with sheet resistance within the scope of the ideal P-N junction surface sheet resistance 60-200 Ω/◻ [28][29][30]. Samples with P-N junction growth enabled by diffusion temperatures of 1000-1150 ∘ C were used for further cell fabrication.…”
Section: Sheet Resistance Measurementsmentioning
confidence: 99%
“…19 Reduced recombination by a lightly doped emitter results in higher V oc and J sc values and lowers the collection losses of photogenerated carriers. Although the conventional selectiveemitter process in crystalline Si solar cells requires multiple doping steps with photomask alignments, [20][21][22] we developed a facile etch-back approach to integrate a self-aligned selective emitter onto a degenerately doped, Si NW solar cell. Robust Ohmic contacts integrated with lightly doped antireective Si NWs were obtained using one-step thermal diffusion.…”
Section: Introductionmentioning
confidence: 99%
“…These doped regions can act as emitters, back-surface fields (BSFs), and floating junctions in solar cell structures. [1][2][3][4][5][6][7][8] LD can be performed in an ambient atmosphere at room temperature. In LD, only the irradiated area is heated and impurities diffuse to the substrate without thermal damage.…”
Section: Introductionmentioning
confidence: 99%