1993
DOI: 10.1049/el:19930755
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Extremely smooth sidewalls for GaAs/AlGaAs ridge waveguides

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Cited by 8 publications
(1 citation statement)
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“…The photolithography step using the waveguide mask produced then 3 urn wide photoresist stripes. These structures were postbaked in a convection oven at 130 0 C in order to allow a reflow of the photoresist and to achieve very smooth sidewalls [85]. The dry etching was performed by magnetic field-enhanced reactive ion etching (MERIE) using 2 seem SiCl 4 at 0.2 mTorr pressure, 200 W rf power, and -110 V dc bias [86].…”
Section: A21 Waveguide Dry Etchingmentioning
confidence: 99%
“…The photolithography step using the waveguide mask produced then 3 urn wide photoresist stripes. These structures were postbaked in a convection oven at 130 0 C in order to allow a reflow of the photoresist and to achieve very smooth sidewalls [85]. The dry etching was performed by magnetic field-enhanced reactive ion etching (MERIE) using 2 seem SiCl 4 at 0.2 mTorr pressure, 200 W rf power, and -110 V dc bias [86].…”
Section: A21 Waveguide Dry Etchingmentioning
confidence: 99%