Fabrication of a miniature thermoelectric module with elements composed of sintered Bi-Te compounds

Kishi, Matsuo; Yoshida, Yūji; Okano, Haruo; Nemoto, Hiroyuki; Funanami, Y.; Yamamoto, M.; Kanazawa, Hirotaka

doi:10.1109/ict.1997.667614

Cited by 11 publications

(2 citation statements)

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“…"Bulk" coolersareill suitedto further integrationwith electronic devicesandcomponentssincethey aretypically much largerthantheactiveregionof the devices,both in cross-sectional area(typically over 1 cm2)andthickness(thermoelements usually I mm thick or higher). In addition,eventhe smallestcoolersnow commerciallyavailable [8][9][10] arelimited in numberof legs,(usuallylessthan200legs)dueto both thermo-mechanical restrictionsandthe often painstakingsemi-manual assemblytechniques, severelycurbingthe rangeof operatingcurrentandvoltage.On the otherhand,microcoolerscould bemanufactured usingthin film depositionandintegratedcircuit techniquescompatiblewith electronicdevice fabrication,andcould literally havethousandsof miniaturelegsinterconnected in a variety of waysto provideoperatingvoltageandcurrentflexibility. Moreover,the responsetime of such microcoolerswould be dramaticallyshortenedandcould proveto be compatiblewith transient operationof selectedelectronics [1I].…”

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confidence: 99%

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

et al. 1998

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Advanced thermoelectric microdevices integrated into thermal management packages and low power, electrical source systems are of interest for a variety of space and terrestrial applications. By shrinking the size of the thermoelements, or legs, of these devices, it becomes possible to handle much higher heat fluxes, as well as operate at much lower currents and higher voltages that are more compatible with electronic components. The miniaturization of state-of-the-art thermoelectric module technology based on Bi2Te3 alloys is limited due to mechanical and manufacturing constraints for both leg dimensions (100–200 μm thick minimum) and the number of legs (100–200 legs maximum). We are investigating the development of novel microdevices combining high thermal conductivity substrate materials such as diamond, thin film metallization and patterning technology, and electrochemical deposition of thick thermoelectric films. It is anticipated that thermoelectric microcoolers with thousands of thermocouples and capable of pumping more than 200 W/cm2 over a 30 to 60 K temperature diffrence can be fabricated. In this paper, we report on our progress in developing an electrochemical deposition process for obtaining 10–50 μm thick films of Bi2Te3 and its solid solutions. Results presented here indicate that good quality n-type Bi2Te3, n-type Bi2Te2.95Se0.05 and p-type Bi0.5Sb1.5Te3 thick films can be deposited by this technique. Some details about the fabrication of the miniature thermoelements are also described.

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confidence: 99%

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

et al. 1998

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“…We have not used wellknown method of brazing by electro deposition of soldering alloy despite that in this case there is no thermal stress. However electro-brazing is time consuming and is not suitable for large scale industrial production and may be successfully used rather for micro module manufacturing [13]. We found that preheating procedure before dipping samples into molten SnSb soldering alloy helps to achieve good material and contact strengths.…”

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confidence: 98%

Mechanical Properties of the Interface between Nickel Contact and Extruded (Bi1-xSbx)2(Te1-ySey)3 Thermoelectric Materials

Vasilevskiy

Roy

Renaud

et al. 2006

2006 25th International Conference on Thermoelectrics

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We present detailed studies of the mechanical behavior of electrical contacts since they have a strong effect on the performance and long term reliability of thermoelectric (TE) modules both for cooling and electricity generation. We have studied the mechanical properties of electroplated and electroless plated Ni contacts on n-type and p-type (Bi 1−x Sb x ) 2 (Te 1−y Se y ) 3, polycrystalline quaternary alloys. These alloys were obtained by mechanical alloying followed by hot extrusion. A variety of surface preparation methods and metallization processes were applied and compared. As soldering alloys we used Sn(60%)Pb(40%) or Sn(95%)Sb(5%) on top of the Ni contacts. Our results show that it is possible to reach mechanical strength above 350 kg/cm 2 when proper metallization and soldering technologies are applied. Contact reliability becomes especially important for short-legged modules, which provide higher density of cooling and generating power. Extruded TE materials may be the only ones suitable for devices where the required mechanical stress is very high.

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Integrated microthermoelectric coolers with rapid response time and high device reliability

Fernández

Ramos

et al. 2018

Nat Electron

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Fabrication of a miniature thermoelectric module with elements composed of sintered Bi-Te compounds

Cited by 11 publications

References 1 publication

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

Mechanical Properties of the Interface between Nickel Contact and Extruded (Bi1-xSbx)2(Te1-ySey)3 Thermoelectric Materials

Integrated microthermoelectric coolers with rapid response time and high device reliability

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