2016
DOI: 10.3390/ma9010041
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Failure Analysis in Magnetic Tunnel Junction Nanopillar with Interfacial Perpendicular Magnetic Anisotropy

Abstract: Magnetic tunnel junction nanopillar with interfacial perpendicular magnetic anisotropy (PMA-MTJ) becomes a promising candidate to build up spin transfer torque magnetic random access memory (STT-MRAM) for the next generation of non-volatile memory as it features low spin transfer switching current, fast speed, high scalability, and easy integration into conventional complementary metal oxide semiconductor (CMOS) circuits. However, this device suffers from a number of failure issues, such as large process varia… Show more

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Cited by 76 publications
(49 citation statements)
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“…The current density for switching of STT-MRAM is relatively large and hence large transistors are inevitable to drive it, which thus significantly limits their future use for memory applications 6,7 . The sustainability of higher switching current density of the tunnel barrier also raises reliability issues and leads to the degradation of related MTJ performance, such as, tunnel magneto resistance (TMR), write current margin, and write speed on the time span [8][9][10] . The situation will be even much worse when further scaling of STT-MRAM enters into a nanometer regime.…”
mentioning
confidence: 99%
“…The current density for switching of STT-MRAM is relatively large and hence large transistors are inevitable to drive it, which thus significantly limits their future use for memory applications 6,7 . The sustainability of higher switching current density of the tunnel barrier also raises reliability issues and leads to the degradation of related MTJ performance, such as, tunnel magneto resistance (TMR), write current margin, and write speed on the time span [8][9][10] . The situation will be even much worse when further scaling of STT-MRAM enters into a nanometer regime.…”
mentioning
confidence: 99%
“…The main issues that can arise during this fabrication step are: material contamination, rough surface layers, and reduced integrity of the oxide barrier. These issues can lead to a wide variation in the cell resistance and switching current [123,124].…”
Section: Defectsmentioning
confidence: 99%
“…For the large scale silver‐based processes, magnetron sputtering is a widely used technique because of its low cost, high‐deposition rate, and stability. It also provides relatively good yield, simple processing, and excellent thickness control over 300 mm wafer …”
Section: Introductionmentioning
confidence: 99%
“…It also provides relatively good yield, simple processing, and excellent thickness control over 300 mm wafer. 8 In case low emissivity coatings on glass, generally, thin silver layer was sandwiched between two dielectric layers such as dielectric/Ag/dielectric such as AZO/Ag/AZO. 9,10 Conductivity of Ag film correlated with optical properties has main role on emissivity of the film stacks.…”
Section: Introductionmentioning
confidence: 99%