2019
DOI: 10.1109/tetc.2017.2691263
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Challenges and Solutions in Emerging Memory Testing

Abstract: International audienceThe research and prototyping of new memory technologies are getting a lot of attention in order to enable new (computer) architectures and provide new opportunities for today’s and future applications. Delivering high quality and reliability products was and will remain a crucial step in the introduction of new technologies. Therefore, appropriate fault modelling, test development and design for testability (DfT) is needed. This paper overviews and discusses the challenges and the emergin… Show more

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Cited by 46 publications
(38 citation statements)
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“…Faulty devices are generally encountered in analog computing systems, due to many reasons, such as fabrication process variations, spot defects, aging phenomenon, mechanical stress, heavy device testing and utilization, etc. ( Lewyn et al, 2009 ; Vatajelu E.I. et al, 2019 ; El-Sayed et al, 2020 ).…”
Section: Resultsmentioning
confidence: 99%
“…Faulty devices are generally encountered in analog computing systems, due to many reasons, such as fabrication process variations, spot defects, aging phenomenon, mechanical stress, heavy device testing and utilization, etc. ( Lewyn et al, 2009 ; Vatajelu E.I. et al, 2019 ; El-Sayed et al, 2020 ).…”
Section: Resultsmentioning
confidence: 99%
“…At this stage, both under-polishing and over-polishing of the surface can introduce defects. Specifically, under-polishing causes issues such as orange peel coupling or offset fields which affect the hysteresis curve, while over-polishing may result in dishing or residual slurry particles that are left behind [14].…”
Section: Beol Defectsmentioning
confidence: 99%
“…Finally, existing fault modeling approaches are unsystematic, and the fault model terminology is ambiguous. For instance, Chintaluri et al [11] refer to a failed transition write fault as transition fault (TF), while Vatajelu et al [14] use the term slow write fault (SWF) to describe the same faulty behavior. In addition, the term read distrub fault (RDF) is used to describe different faulty behaviors with different failure mechanisms in [11] and [15].…”
Section: Introductionmentioning
confidence: 99%
“…After the FEOL phase, the lower metal layers are deposited in the BEOL phase. Lithographic issues or misalignment may cause defects here, resulting in shorts or opens in the wiring [37]. These defects again affect both the peripherals and the memory array.…”
Section: A Defect Modelingmentioning
confidence: 99%