Fast and accurate non-contact in situ optical metrology for end-point detection

Fiber optics low-coherence IR interferometry for defense sensors manufacturing

“…We reported both silicon [3], and compound materials applications [9], [12]. In past several systems were reported including multi-probe systems [8], and fast systems enabling applications capable to measure wafer thickness during grinding process [4,5]. Finally, the reference plane solutions have been invented allowing to reduce dependence of the measured signal on temperature variations [10].…”

“…Low coherence optical interferometry [1] has been proven to be an effective tool for characterization of thin and ultrathin semiconductor Si wafers, compound materials, MEMs, detector structures, light emitting devices and others [2][3][4][5][6][7][8][9][10][11][12][13][14]. The commonly employed tools for wafer thickness metrology are based on capacitance or air pressure methods.…”